UL865NAD206T701

UL865NAD206T701

  • Description:IC RF 3D CELL MODULE 48VQFN
  • Series:-
  • Mfr:Telit Cinterion
  • Package:Tray

SKU:fb6c2cfa9957 Category: Brand:

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Product Detailed Parameters

  • Description:IC RF 3D CELL MODULE 48VQFN
  • Series:-
  • Mfr:Telit Cinterion
  • Package:Tray
  • Type:-
  • RF Family/Standard:-
  • Protocol:-
  • Modulation:-
  • Frequency:-
  • Data Rate (Max):-
  • Power - Output:-
  • Sensitivity:-
  • Memory Size:-
  • Serial Interfaces:-
  • Voltage - Supply:-
  • Current - Receiving:-
  • Current - Transmitting:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:48-BQFN Module
  • Supplier Device Package:48-VQFN (24.4x24.4)
  • GPIO:-
  • Grade:-
  • Qualification:-

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UL865NAD206T701

Buying Guide
Summary

Telit Cinterion UL865NAD206T701 is used in RF Transceiver ICs category in RF signal paths where layout, grounding, and interface choices determine real performance. Key specs include Description (IC RF 3D CELL MODULE 48VQFN), Package/case (48-BQFN Module), Mounting (Surface Mount), and Packaging (Tray).

Selection Notes
  • For UL865NAD206T701, make sure the mounting type (Surface Mount) matches how the part will be installed and inspected.
  • Double-check the package/case (48-BQFN Module) and recommended land pattern before ordering.
  • Verify the mounting type (Surface Mount) fits your manufacturing and inspection workflow.
  • In RF Transceiver ICs designs, confirm sourcing and lifecycle status (availability, second source) before committing to production.
Alternates & Substitutions
  • For RF Transceiver ICs substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Start by confirming the physical match (package/case 48-BQFN Module, supplier package 48-VQFN (24.4x24.4), mounting Surface Mount) so the swap does not create a footprint risk.
  • Confirm absolute maximum ratings and recommended operating conditions match your system constraints before approval.
  • For RF parts, validate the alternate in the real enclosure and cabling, not only in a bench setup.
FAQ

Who is the manufacturer of UL865NAD206T701?
Telit Cinterion

Any tips for integrating UL865NAD206T701 into an RF signal path?
Pay attention to impedance continuity, grounding, connector transitions, and layout symmetry to minimize loss and reflections.

How is UL865NAD206T701 mounted?
Surface Mount

How is UL865NAD206T701 supplied (packaging)?
Tray

Application Scenarios

Telit Cinterion UL865NAD206T701 shows up under RF Transceiver ICs when designers want a well-bounded, datasheet-driven building block instead of a fragile board-level workaround. Minor layout differences can shift spurs and margins, so evaluation includes grounding, stack-up, shielding, and test access from day one. Because RF is system-defined, teams validate with realistic antennas, cables, and enclosures rather than assuming lab fixtures represent the product. Within smart meters, stable RF performance reduces read failures caused by temperature drift and installation variability. In smart meters and gateways, RF robustness reduces dropouts when radios sit near switching supplies and noisy wiring harnesses. In automotive GNSS and connectivity, filtering and shielding choices influence sensitivity under inverter and DC-DC noise. A brief worst-case sweep can show whether performance is margin-driven or tuning-driven. Across practice, disciplined selection and verification reduce integration risk and improve field reliability.

Compatibility Advice
  • For RF Transceiver ICs compatibility, validate impedance matching, shielding, and return paths in the final enclosure. This keeps qualification evidence reproducible later.
Project Fit
  • Best fit for RF Transceiver ICs when you can validate impedance matching, shielding, and coexistence inside the final enclosure.
UL865NAD206T701UL865NAD206T701

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