ZL88602LDF1

ZL88602LDF1

$5.92
  • Description:IC TELECOM INTERFACE 64QFN
  • Series:-

SKU:58c35ca54d64 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE 64QFN
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tape & Reel (TR)
  • Function:Telecom Circuit
  • Interface:PCM
  • Number of Circuits:1
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:-
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:64-VFQFN Exposed Pad
  • Supplier Device Package:64-QFN (9x9)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

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ZL88602LDF1

Buying Guide
Summary

Microchip Technology ZL88602LDF1 is used in Telecom category where integration and verification need to stay predictable. Key specs include Description (IC TELECOM INTERFACE 64QFN), Packaging (Tape & Reel (TR)), Supply (3.135V ~ 3.465V), Temperature (-40°C ~ 85°C), and Package/case (64-VFQFN Exposed Pad).

Selection Notes
  • For ZL88602LDF1, confirm the data interface (PCM) matches your host interface and timing requirements.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
  • Make sure Number of Circuits (1) aligns with your design targets and verification plan.
  • Ensure the package/case (64-VFQFN Exposed Pad) and land pattern match your PCB layout before procurement.
Alternates & Substitutions
  • For Telecom, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Check that supply 3.135V ~ 3.465V, temperature -40°C ~ 85°C matches your system, then validate at corners instead of relying on typical values.
  • Start by confirming the physical match (package/case 64-VFQFN Exposed Pad, supplier package 64-QFN (9x9), mounting Surface Mount) so the swap does not create a footprint risk.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
FAQ

What Supplier Device Package does ZL88602LDF1 have?
64-QFN (9x9)

What package/case does ZL88602LDF1 use?
64-VFQFN Exposed Pad

What is the mounting type of ZL88602LDF1?
Surface Mount

Which packaging format is listed for ZL88602LDF1?
Tape & Reel (TR)

Application Scenarios

In practice, for many Telecom designs, Microchip Technology ZL88602LDF1 is vetted against electrical margins, thermal headroom, and mechanical integration before the BOM is frozen. A robust RF choice often reduces late surprises by keeping coexistence and emissions behavior predictable under routing constraints. A well-chosen RF choice shortens the path from prototype to certification by reducing uncertainty in high-frequency routing and filtering. Within smart meters, stable RF performance reduces read failures caused by temperature drift and installation variability. In IoT gateways, matching and filtering improve sensitivity and coexistence in crowded 2.4 GHz and sub-GHz environments. Across aerospace telemetry, predictable RF routing and isolation improve resilience to interference and maintain link margin over long distances.

Compatibility Advice
  • With the real source, load, and wiring, verify supply cleanliness and grounding near the RF block, because conducted noise often shows up as desense or emissions. This helps field behavior stay predictable across lots.
  • To avoid late surprises, validate with realistic antennas and fixtures rather than assuming lab setups represent the product during bring-up and production test.
  • In qualification work, check placement and shielding constraints so isolation and keep-out requirements can be met before committing to volume builds.
Project Fit
  • Most suitable when you can test and document Microchip Technology ZL88602LDF1 for Telecom integration on the assembled PCB, especially if you need stable link margin across temperature and installation variance. However, a weaker fit when integrating Microchip Technology ZL88602LDF1 for Telecom, the system cannot provide clean supplies and stable grounding near the RF block, because the integration depends on constraints that cannot be controlled across builds.
ZL88602LDF1ZL88602LDF1
$5.92
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