ZSSC3170FE2T

ZSSC3170FE2T

$4.68
  • Description:IC INTFACE SPECIALIZED SGNL COND
  • Series:-

SKU:7d9729d478b7 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC INTFACE SPECIALIZED SGNL COND
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tube
  • Applications:Sensor Signal Conditioner - Resistive
  • Interface:I2C, LIN, PWM, ZACwire™ One-Wire Interface
  • Voltage - Supply:4.75V ~ 5.25V
  • Package / Case:20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package:20-SSOP
  • Grade:Automotive
  • Qualification:AEC-Q100
  • Mounting Type:Surface Mount

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ZSSC3170FE2T

Buying Guide
Summary

Renesas Electronics Corporation ZSSC3170FE2T is an electronic component in Specialized category. Key specs: description: IC INTFACE SPECIALIZED SGNL COND; packaging: Tube; supply: 4.75V ~ 5.25V; package/case: 20-SSOP (0.209", 5.30mm Width); mounting: Surface Mount.

Selection Notes
  • For ZSSC3170FE2T, confirm package/case 20-SSOP (0.209", 5.30mm Width), mounting Surface Mount to ensure footprint compatibility.
  • For ZSSC3170FE2T, check the supply voltage requirement (4.75V ~ 5.25V) and any rail tolerance constraints.
  • For ZSSC3170FE2T, confirm packaging option and moisture sensitivity handling if your assembly process requires it (mounting Surface Mount; packaging Tube).
FAQ

What information do you need to quote ZSSC3170FE2T?
Send the part number (ZSSC3170FE2T), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for ZSSC3170FE2T?
Renesas Electronics Corporation

What is the supply voltage range of ZSSC3170FE2T?
4.75V ~ 5.25V

What is the packaging of ZSSC3170FE2T?
Tube

Application Scenarios
In the Specialized category, Renesas Electronics Corporation ZSSC3170FE2T is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. A good selection improves integration speed and lowers lifecycle risk. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
ZSSC3170FE2TZSSC3170FE2T
$4.68
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