TCD1304DG(8Z,AW)

TCD1304DG(8Z,AW)

$15.99
  • Description:CCD SENSOR/LINEAR PB-F/DIGITAL L
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tray

SKU:872bdc3d75c9 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:CCD SENSOR/LINEAR PB-F/DIGITAL L
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tray
  • Type:CCD
  • Pixel Size:8µm x 200µm
  • Active Pixel Array:-
  • Frames per Second:-
  • Voltage - Supply:3V
  • Package / Case:22-CDIP (0.400", 10.16mm)
  • Supplier Device Package:22-CDIP
  • Operating Temperature:-
  • Grade:-
  • Qualification:-

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TCD1304DG(8Z,AW)

Buying Guide
Summary

Toshiba Semiconductor and Storage TCD1304DG8ZAW is selected in Image Sensors, Camera category when calibration, drift, and environment constraints must be validated early. Key specs include Description (CCD SENSOR/LINEAR PB-F/DIGITAL L), Type (CCD), and Package/case (22-CDIP (0.400", 10.16mm)).

Selection Notes
  • For TCD1304DG8ZAW, verify Pixel Size (8µm x 200µm) matches your requirements and the datasheet test conditions.
  • Double-check the package/case (22-CDIP (0.400", 10.16mm)) and recommended land pattern before ordering.
  • Verify your power rails meet the supply requirement (3V) under worst-case conditions.
  • For Image Sensors, Camera applications, confirm packaging and handling requirements for your assembly process.
Alternates & Substitutions
  • For Image Sensors, Camera, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Then confirm the operating envelope (supply 3V) with margin for transients and derating.
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
  • Before approving a second source, compare the functional mode matrix and the test conditions behind the marketing headline specs.
FAQ

What package type does TCD1304DG8ZAW come in?
22-CDIP (0.400", 10.16mm)

Which Pixel Size is listed for TCD1304DG8ZAW?
8µm x 200µm

Can you confirm the packaging for TCD1304DG8ZAW?
Tray

What supply voltage range does TCD1304DG8ZAW require?
3V

Application Scenarios

For Toshiba Semiconductor and Storage TCD1304DG8ZAW in the Image Sensors, Camera category, teams usually prioritize documentation clarity and repeatable behavior in production. In practice, for isolation, engineers validate CMTI, propagation delay, and aging; for indicators, they validate readability across ambient light and temperature. Across practice, optoelectronics are judged by stability in the enclosure: thermal rise, optics, alignment, and contamination over time. Within outdoor equipment, UV exposure and moisture drive sealing and derating choices for optical components. Within field sensors, optical contamination and alignment changes are treated as primary risks, so designs validate thresholds with real housings. Within industrial drives, optocouplers provide isolation for feedback and gate control under high dv/dt switching and elevated temperature.

Compatibility Advice
  • To keep validation repeatable, verify environmental stress assumptions (temperature, humidity, contamination) so sensing remains repeatable over life. This keeps qualification evidence reproducible later.
  • For compatibility, validate noise and latency with production-like cabling so the system behaves the same outside the lab. This reduces the chance that substitutions push hidden limits.
Project Fit
  • Strongest fit when you can bench-verify Toshiba Semiconductor and Storage TCD1304DG8ZAW for Image Sensors, Camera integration with production-like fixtures, and you can control mechanical integration and test coverage so drift and degradation are measurable.
TCD1304DG(8Z,AW)TCD1304DG(8Z,AW)
$15.99
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