73M2901CE-IM/F

73M2901CE-IM/F

  • Description:IC MODEM 3.3V V.22BIS 32-QFN
  • Series:-

SKU:b7ed21b37e51 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODEM 3.3V V.22BIS 32-QFN
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tray
  • Data Format:V.21, V.22, V.23, Bell 103, Bell 212A
  • Baud Rates:300 ~ 9.6k
  • Voltage - Supply:2.7V ~ 3.6V
  • Mounting Type:Surface Mount
  • Package / Case:32-VFQFN Exposed Pad
  • Supplier Device Package:32-QFN (5x5)

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73M2901CE-IM/F

Buying Guide
Summary

Analog Devices Inc./Maxim Integrated 73M2901CE-IM-F is an electronic component in Modems - ICs and Modules category. Key specs: description: IC MODEM 3.3V V.22BIS 32-QFN; packaging: Tray; supply: 2.7V ~ 3.6V; package/case: 32-VFQFN Exposed Pad; mounting: Surface Mount.

Selection Notes
  • For 73M2901CE-IM-F, confirm package/case 32-VFQFN Exposed Pad, mounting Surface Mount to ensure footprint compatibility.
  • For 73M2901CE-IM-F, check the supply voltage requirement (2.7V ~ 3.6V) and any rail tolerance constraints.
  • For 73M2901CE-IM-F, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (package/case 32-VFQFN Exposed Pad; mounting Surface Mount).
FAQ

What information do you need to quote 73M2901CE-IM-F?
Send the part number (73M2901CE-IM-F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 73M2901CE-IM-F?
Analog Devices Inc./Maxim Integrated

What is the mounting type of 73M2901CE-IM-F?
Surface Mount

What is the supply current of 73M2901CE-IM-F?
V.21, V.22, V.23, Bell 103, Bell 212A

Application Scenarios
For Analog Devices Inc./Maxim Integrated 73M2901CE-IM-F in the Modems - ICs and Modules category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. Engineers focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. In IoT gateways, matching and filtering improve sensitivity and coexistence in crowded 2.4 GHz and sub-GHz environments. Overall, it improves predictability by keeping key performance stable across manufacturing variance and operating conditions.
73M2901CE-IM/F73M2901CE-IM/F

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