1SV324TPH3F

1SV324TPH3F

$0.36
  • Description:DIODE TCXO/VCO 10V USC
  • Series:-

SKU:047bc501b5a8 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE TCXO/VCO 10V USC
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Capacitance @ Vr, F:12pF @ 4V, 1MHz
  • Capacitance Ratio:4.3
  • Capacitance Ratio Condition:C1/C4
  • Voltage - Peak Reverse (Max):10 V
  • Diode Type:Single
  • Q @ Vr, F:-
  • Operating Temperature:125°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:SC-76, SOD-323
  • Supplier Device Package:USC

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1SV324TPH3F

Buying Guide
Summary

Toshiba Semiconductor and Storage 1SV324TPH3F is an electronic component in Variable Capacitance (Varicaps, Varactors) category. Key specs: description: DIODE TCXO/VCO 10V USC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: 125°C (TJ); package/case: SC-76, SOD-323; mounting: Surface Mount; frequency: 12pF @ 4V, 1MHz.

Selection Notes
  • For 1SV324TPH3F, confirm package/case SC-76, SOD-323, mounting Surface Mount to ensure footprint compatibility.
  • For 1SV324TPH3F, validate the operating temperature range (125°C (TJ)) against your environment.
  • For 1SV324TPH3F, confirm the operating frequency (12pF @ 4V, 1MHz) and any related tolerance requirements.
FAQ

What should I provide for an accurate quote for 1SV324TPH3F?
Send the part number (1SV324TPH3F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1SV324TPH3F?
Toshiba Semiconductor and Storage

What is the mounting type of 1SV324TPH3F?
Surface Mount

What is the operating frequency of 1SV324TPH3F?
12pF @ 4V, 1MHz

Application Scenarios
Toshiba Semiconductor and Storage 1SV324TPH3F in the Variable Capacitance (Varicaps, Varactors) category is typically selected when engineers need predictable, spec-driven behavior in a production design. Biasing, thermal design, and output matching are treated as system-level problems, not just a schematic choice. Good RF building blocks accelerate certification and reduce re-spin risk in antenna-to-baseband designs. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
1SV324TPH3F1SV324TPH3F
$0.36
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