25EMPPC603E2BB200Z

25EMPPC603E2BB200Z

$29.04
  • Description:IC MPU 200MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk

SKU:f490df292e79 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:chipapexlimited@gmail.com
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

*
*
*
*
Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MPU 200MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk
  • Core Processor:PowerPC EM603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:200MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:278-BBGA, FCBGA
  • Supplier Device Package:278-FCPBGA (21x21)
  • Additional Interfaces:-

Download product information

25EMPPC603E2BB200Z

Buying Guide
Summary

IBM 25EMPPC603E2BB200Z is selected in Microprocessors category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MPU 200MHZ 278FCPBGA), Core (PowerPC EM603e), Speed (200MHz), Temperature (0°C ~ 105°C (TJ)), and Package/case (278-BBGA, FCBGA).

Selection Notes
  • For 25EMPPC603E2BB200Z, verify the operating temperature range (0°C ~ 105°C (TJ)) and derate as needed in your application.
  • Verify Number of Cores/Bus Width (1 Core, 32-Bit) matches your requirements and the datasheet test conditions.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
  • Verify the mounting type (Surface Mount) fits your manufacturing and inspection workflow.
Alternates & Substitutions
  • For Microprocessors, validate alternates under worst-case corners rather than assuming typical-only conditions represent production builds.
  • When evaluating alternates, treat package/case 278-BBGA, FCBGA, supplier package 278-FCPBGA (21x21), mounting Surface Mount as non-negotiable unless you are re-spinning the PCB.
  • Validate the min/max operating conditions (temperature 0°C ~ 105°C (TJ)) and keep headroom for worst-case corners.
  • For MCU/memory substitutions, match speed 200MHz and verify pin-mux, timing margins, and power sequencing.
FAQ

Who is the manufacturer of 25EMPPC603E2BB200Z?
IBM

What are common selection points for a microcontroller like 25EMPPC603E2BB200Z?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

Which Graphics Acceleration is specified for 25EMPPC603E2BB200Z?
No

What mounting type does 25EMPPC603E2BB200Z use?
Surface Mount

Application Scenarios

When IBM 25EMPPC603E2BB200Z is used in Microprocessors designs, teams typically start by confirming interfaces, supply rails, operating envelope, and qualification expectations. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. In real deployments, across smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In practice, predictable margins and repeatable validation are what keep field behavior consistent.

Compatibility Advice
  • On the assembled PCB, confirm boot mode, strapping, and reset sequencing so bring-up is deterministic across assembly variance. This avoids one-off tuning in production.
  • In qualification work, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable before committing to volume builds.
Project Fit
  • A weaker fit when integrating IBM 25EMPPC603E2BB200Z for Microprocessors, debug and programming access is not practical, increasing field recovery risk, because the integration depends on constraints that cannot be controlled across builds.
25EMPPC603E2BB200Z25EMPPC603E2BB200Z
$29.04
Buy Now