25EMPPC603EBC-166

25EMPPC603EBC-166

$32.96
  • Description:IC MPU 166MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk

SKU:393afc9fd518 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MPU 166MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk
  • Core Processor:PowerPC EM603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:166MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:278-BBGA, FCBGA
  • Supplier Device Package:278-FCPBGA (21x21)
  • Additional Interfaces:-

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25EMPPC603EBC-166

Buying Guide
Summary

IBM 25EMPPC603EBC-166 is used in Microprocessors category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MPU 166MHZ 278FCPBGA), Core (PowerPC EM603e), Speed (166MHz), Temperature (0°C ~ 105°C (TJ)), and Package/case (278-BBGA, FCBGA).

Selection Notes
  • For 25EMPPC603EBC-166, verify Number of Cores/Bus Width (1 Core, 32-Bit) matches your requirements and the datasheet test conditions.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
  • Verify the operating temperature range (0°C ~ 105°C (TJ)) and derate as needed in your application.
Alternates & Substitutions
  • In Microprocessors, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Confirm the physical match (package/case 278-BBGA, FCBGA, supplier package 278-FCPBGA (21x21), mounting Surface Mount) and the operating corners (temperature 0°C ~ 105°C (TJ)) so the substitution is not a hidden redesign.
  • For digital parts, align speed 166MHz and validate firmware/boot and signal integrity assumptions before production.
  • Before approving a second source, compare the functional mode matrix and the test conditions behind the marketing headline specs.
FAQ

How is 25EMPPC603EBC-166 packaged?
Bulk

Which Number of Cores/Bus Width is specified for 25EMPPC603EBC-166?
1 Core, 32-Bit

Which operating temperature range is listed for 25EMPPC603EBC-166?
0°C ~ 105°C (TJ)

What Supplier Device Package does 25EMPPC603EBC-166 have?
278-FCPBGA (21x21)

Application Scenarios

Selecting IBM 25EMPPC603EBC-166 for Microprocessors usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. In real deployments, they execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Across industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. In practice, within smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In field deployments, stable behavior across temperature and supply variation is what prevents hard-to-reproduce failures.

Compatibility Advice
  • For Microprocessors compatibility, validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Best fit for Microprocessors when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
25EMPPC603EBC-16625EMPPC603EBC-166
$32.96
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