25EMPPC750CBUF166Z

25EMPPC750CBUF166Z

$64.78
  • Description:IC MPU 166MHZ 360CBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk

SKU:37c2854d9210 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MPU 166MHZ 360CBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk
  • Core Processor:PowerPC 750
  • Number of Cores/Bus Width:1 Core
  • Speed:166MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 105°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:360-BCBGA
  • Supplier Device Package:360-CBGA (25x25)
  • Additional Interfaces:-

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25EMPPC750CBUF166Z

Buying Guide
Summary

IBM 25EMPPC750CBUF166Z is used in Microprocessors category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MPU 166MHZ 360CBGA), Core (PowerPC 750), Speed (166MHz), Temperature (-40°C ~ 105°C (TJ)), and Package/case (360-BCBGA).

Selection Notes
  • For 25EMPPC750CBUF166Z, double-check Graphics Acceleration (No) against your specification and operating conditions.
  • Ensure the package/case (360-BCBGA) and land pattern match your PCB layout before procurement.
  • Validate the operating temperature range (-40°C ~ 105°C (TJ)) for your environment and margin.
  • Confirm the mounting type (Surface Mount) is suitable for your production flow and reliability target.
Alternates & Substitutions
  • For Microprocessors, compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • For any substitution, verify the datasheet conditions behind headline specs and validate the alternate under your worst-case operating corners.
  • Check that temperature -40°C ~ 105°C (TJ) matches your system, then validate at corners instead of relying on typical values.
  • For MCU/memory substitutions, match speed 166MHz and verify pin-mux, timing margins, and power sequencing.
FAQ

What temperature range is listed for 25EMPPC750CBUF166Z?
-40°C ~ 105°C (TJ)

What is the Supplier Device Package of 25EMPPC750CBUF166Z?
360-CBGA (25x25)

Which packaging option is listed for 25EMPPC750CBUF166Z?
Bulk

Which Number of Cores/Bus Width is listed for 25EMPPC750CBUF166Z?
1 Core

Application Scenarios

When sourcing IBM 25EMPPC750CBUF166Z for Microprocessors, engineers typically focus on de-risking integration and keeping validation repeatable. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In real deployments, they execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. The practical lens is always the same: validate it in the system, not in isolation. Over the product lifecycle, it reduces maintenance burden by keeping behavior spec-driven and testable.

Compatibility Advice
  • In practice, verify clock, debug, and programming access so production test and field recovery are practical during bring-up and production test.
Project Fit
  • Ideal when you can verify IBM 25EMPPC750CBUF166Z for Microprocessors integration across temperature and supply corners, if you need deterministic boot and recovery behavior and can validate it across power sequencing and resets.
  • More fragile when integrating IBM 25EMPPC750CBUF166Z for Microprocessors, debug and programming access is not practical, increasing field recovery risk, because integration risk stays high when key margins cannot be measured.
25EMPPC750CBUF166Z25EMPPC750CBUF166Z
$64.78
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