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25PPC750CXEFP2022

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

25PPC750CXEFP2022

25PPC750CXEFP2022

$91.35
  • Description：IC MPU 400MHZ 256BGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk

SKU:ca39699f2b95 Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC MPU 400MHZ 256BGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk
  • Core Processor：PowerPC 750CX
  • Number of Cores/Bus Width：1 Core, 32-Bit
  • Speed：400MHz
  • Co-Processors/DSP：-
  • RAM Controllers：-
  • Graphics Acceleration：No
  • Display & Interface Controllers：-
  • Ethernet：-
  • SATA：-
  • USB：-
  • Voltage - I/O：1.8V, 2.5V
  • Operating Temperature：-40°C ~ 105°C (TJ)
  • Security Features：-
  • Mounting Type：Surface Mount
  • Package / Case：256-LBGA
  • Supplier Device Package：256-PBGA (27x27)
  • Additional Interfaces：-

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25PPC750CXEFP2022

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

IBM 25PPC750CXEFP2022 is selected in Microprocessors category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MPU 400MHZ 256BGA), Core (PowerPC 750CX), Speed (400MHz), Temperature (-40°C ~ 105°C (TJ)), and Package/case (256-LBGA).

Selection Notes
  • For 25PPC750CXEFP2022, verify the operating temperature range (-40°C ~ 105°C (TJ)) and derate as needed in your application.
  • Verify Number of Cores/Bus Width (1 Core, 32-Bit) matches your requirements and the datasheet test conditions.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
  • Make sure Voltage - I/O (1.8V, 2.5V) aligns with your design targets and verification plan.
Alternates & Substitutions
  • In Microprocessors, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • For substitutions, match the footprint-related items first: package/case 256-LBGA, supplier package 256-PBGA (27x27), mounting Surface Mount.
  • Then confirm the operating envelope (temperature -40°C ~ 105°C (TJ)) with margin for transients and derating.
  • For digital parts, align speed 400MHz and validate firmware/boot and signal integrity assumptions before production.
FAQ

Any tips for migrating firmware to 25PPC750CXEFP2022?
Confirm pin functions, peripheral differences, timing assumptions, and memory layout, then validate under worst-case operating conditions.

Can you confirm the Graphics Acceleration for 25PPC750CXEFP2022?
No

Can you confirm the packaging for 25PPC750CXEFP2022?
Bulk

Which Speed is specified for 25PPC750CXEFP2022?
400MHz

Application Scenarios

Selecting IBM 25PPC750CXEFP2022 for Microprocessors usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Across building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In practice, within consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • For production stability, validate startup states and default pin configurations so connected peripherals do not enter unsafe modes at reset on the assembled PCB.
  • Before freezing the BOM, validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners. This reduces the chance that substitutions push hidden limits.
  • In practice, confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation during bring-up and production test.
Project Fit
  • Works best when you can test and document IBM 25PPC750CXEFP2022 for Microprocessors integration across temperature and supply corners, typically when you can control power sequencing and decoupling so brownouts and erratic resets are avoided. In contrast, less ideal when integrating IBM 25PPC750CXEFP2022 for Microprocessors, I/O voltage domains are uncertain, increasing long-term overstress and compatibility risk, because integration risk stays high when key margins cannot be measured.
25PPC750CXEFP202225PPC750CXEFP2022
$91.35
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