100-1254-2

100-1254-2

$275.32
  • Description:IC MOD CM-BF527 600MHZ 64MB
  • Series:Blackfin®

SKU:3460504d804f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MOD CM-BF527 600MHZ 64MB
  • Series:Blackfin®
  • Mfr:BECOM Systems GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:CM-BF527
  • Co-Processor:-
  • Speed:600MHz
  • Flash Size:8MB
  • RAM Size:64MB
  • Connector Type:Expansion 2 x 60
  • Size / Dimension:1.220" L x 1.420" W (31.00mm x 36.00mm)
  • Operating Temperature:0°C ~ 70°C

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100-1254-2

Buying Guide
Summary

BECOM Systems GmbH 100-1254-2 is used in Microcontrollers, Microprocessor, FPGA Modules category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MOD CM-BF527 600MHZ 64MB), Core (CM-BF527), Speed (600MHz), RAM (64MB), and Temperature (0°C ~ 70°C).

Selection Notes
  • For 100-1254-2, check Module/Board Type (MPU Core) against the datasheet conditions and your system-level constraints.
  • Check program memory (8MB) for bootloader, diagnostics, and future headroom.
  • Verify the operating temperature range (0°C ~ 70°C) and derate as needed in your application.
  • Make sure Size / Dimension (1.220" L x 1.420" W (31.00mm x 36.00mm)) aligns with your design targets and verification plan.
Alternates & Substitutions
  • In Microcontrollers, Microprocessor, FPGA Modules designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Make sure the alternate stays inside your system envelope: temperature 0°C ~ 70°C.
  • For digital parts, align speed 600MHz, memory 64MB and validate firmware/boot and signal integrity assumptions before production.
  • If substitutions are likely, write down the non-negotiables and re-check them when the supply chain changes, not after field failures.
FAQ

Who is the manufacturer of 100-1254-2?
BECOM Systems GmbH

What are common selection points for a microcontroller like 100-1254-2?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.

What Flash Size does 100-1254-2 have?
8MB

Can you confirm the packaging for 100-1254-2?
Bulk

Application Scenarios

When sourcing BECOM Systems GmbH 100-1254-2 for Microcontrollers, Microprocessor, FPGA Modules, engineers typically focus on de-risking integration and keeping validation repeatable. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In practice, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In real deployments, a few focused measurements can reveal whether margins are real or only show up under ideal lab setups. In production builds, repeatability is what protects you from lot variation and environmental stress.

Compatibility Advice
  • In practice, confirm boot mode, strapping, and reset sequencing so bring-up is deterministic across assembly variance on the assembled PCB.
  • Before freezing the BOM, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds. This avoids one-off tuning in production.
  • In practice, check that alternates preserve boot ROM behavior and critical peripherals, not only pin count and frequency during bring-up and production test.
Project Fit
  • Good fit when you can test and document BECOM Systems GmbH 100-1254-2 for Microcontrollers, Microprocessor, FPGA Modules integration with production-like fixtures, and you can provision debug/programming access so production test and field recovery are practical.
  • Poor fit when EMI or thermal constraints are strict but cannot be verified under maximum activity, because it becomes difficult to prove margin across production variance.
100-1254-2100-1254-2
$275.32
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