A5EA013BB23BE5S

A5EA013BB23BE5S

$187.43
  • Description:FPGA AGILEX 5E 138KLE 795VPBGA
  • Series:Agilex E

SKU:129b1f9a4fd2 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:FPGA AGILEX 5E 138KLE 795VPBGA
  • Series:Agilex E
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
  • Flash Size:-
  • RAM Size:512kB
  • Peripherals:DDR, DMA, PCIe, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz, 1.8GHz
  • Primary Attributes:FPGA - 138K Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:795-LFBGA
  • Supplier Device Package:795-VPBGA (23x23)

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A5EA013BB23BE5S

Buying Guide
Summary

Altera A5EA013BB23BE5S is a component in System On Chip (SoC) category typically evaluated for fit, operating limits, and supportability in production. Key specs include Description (FPGA AGILEX 5E 138KLE 795VPBGA), Series (Agilex E), Packaging (Tray), Temperature (0°C ~ 100°C (TJ)), and Package/case (795-LFBGA).

Selection Notes
  • For A5EA013BB23BE5S, confirm Architecture (MPU, FPGA) meets your design constraints and system-level expectations.
  • Confirm the package/case (795-LFBGA) and any exposed-pad requirements for your assembly process.
  • Confirm the operating temperature range (0°C ~ 100°C (TJ)) meets your deployment conditions.
Alternates & Substitutions
  • For System On Chip (SoC), validate alternates under worst-case corners rather than assuming typical-only conditions represent production builds.
  • When evaluating alternates, treat package/case 795-LFBGA, supplier package 795-VPBGA (23x23), packaging Tray as non-negotiable unless you are re-spinning the PCB.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
  • For faster alternate proposals, share the constraints you cannot change (package 795-LFBGA) and your acceptable trade-offs.
FAQ

What details help you quote A5EA013BB23BE5S quickly?
Send the part number (A5EA013BB23BE5S), quantity, target delivery date, and any required packaging or documentation.

Which package/case is listed for A5EA013BB23BE5S?
795-LFBGA

What Supplier Device Package does A5EA013BB23BE5S have?
795-VPBGA (23x23)

What is the Architecture of A5EA013BB23BE5S?
MPU, FPGA

Application Scenarios

For many System On Chip (SoC) designs, Altera A5EA013BB23BE5S is vetted against electrical margins, thermal headroom, and mechanical integration before the BOM is frozen. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. From a validation perspective, the goal is confirming the part still behaves well under real loading and real noise sources. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Across building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. Across consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In real deployments, that discipline usually improves system uptime by reducing intermittent faults and hard-to-reproduce issues.

Compatibility Advice
  • In practice, validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners before freezing the BOM.
Project Fit
  • More fragile when integrating Altera A5EA013BB23BE5S for System On Chip (SoC), boot and recovery behavior depends on sequencing or strapping that cannot be controlled across builds, because the behavior cannot be verified in a repeatable way.
A5EA013BB23BE5SA5EA013BB23BE5S
$187.43
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