XP1001000-05R-AP

XP1001000-05R-AP

$46.70
  • Description:XPORT 05R, BULK, ASIA PAC, ROHS
  • Series:XPort®

SKU:bd7e1c95e218 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:XPORT 05R, BULK, ASIA PAC, ROHS
  • Series:XPort®
  • Mfr:Lantronix, Inc.
  • Package:Bulk
  • Module/Board Type:Ethernet Core
  • Core Processor:DSTni-EX
  • Co-Processor:-
  • Speed:25MHz
  • Flash Size:512KB
  • RAM Size:256KB
  • Connector Type:RJ-45
  • Size / Dimension:1.330" L x 0.640" W (33.90mm x 16.25mm)
  • Operating Temperature:-40°C ~ 85°C

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XP1001000-05R-AP

Buying Guide
Summary

Lantronix, Inc. XP1001000-05R-AP is selected in Microcontrollers, Microprocessor, FPGA Modules category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (XPORT 05R, BULK, ASIA PAC, etc.), Core (DSTni-EX), Speed (25MHz), RAM (256KB), and Temperature (-40°C ~ 85°C).

Selection Notes
  • For XP1001000-05R-AP, verify the available flash/program memory (512KB) matches your code size and feature roadmap.
  • Confirm the operating temperature range (-40°C ~ 85°C) meets your deployment conditions.
  • Verify Size / Dimension (1.330" L x 0.640" W (33.90mm x 16.25mm)) and compare it against your reference design limits.
  • Confirm Connector Type (RJ-45) and ensure it matches your integration requirements.
Alternates & Substitutions
  • For Microcontrollers, Microprocessor, FPGA Modules substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Lock the mechanical constraints first (packaging Bulk) before comparing performance specs.
  • Verify the alternate stays within temperature -40°C ~ 85°C across startup, load steps, and worst-case temperature.
  • For MCU/memory substitutions, match speed 25MHz, memory 256KB and verify pin-mux, timing margins, and power sequencing.
FAQ

Which RAM Size is listed for XP1001000-05R-AP?
256KB

What Module/Board Type is listed for XP1001000-05R-AP?
Ethernet Core

Can you confirm the Flash Size for XP1001000-05R-AP?
512KB

What Size / Dimension is listed for XP1001000-05R-AP?
1.330" L x 0.640" W (33.90mm x 16.25mm)

Application Scenarios

When sourcing Lantronix, Inc. XP1001000-05R-AP for Microcontrollers, Microprocessor, FPGA Modules, engineers typically focus on de-risking integration and keeping validation repeatable. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Within automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. Across medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Early targeted testing tends to expose true integration risks before a design is scaled to production. In production builds, repeatability is what protects you from lot variation and environmental stress.

Compatibility Advice
  • Validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners with the real source, load, and wiring.
Project Fit
  • More fragile when integrating Lantronix, Inc. XP1001000-05R-AP for Microcontrollers, Microprocessor, FPGA Modules, boot and recovery behavior depends on sequencing and strapping that cannot be controlled across builds, because the behavior cannot be verified in a repeatable way.
XP1001000-05R-APXP1001000-05R-AP
$46.70
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