XCF16PFS48C

XCF16PFS48C

  • Description:IC PROM SRL 1.8V 16M 48CSBGA
  • Series:-
  • Mfr:AMD
  • Package:Tray

SKU:6eed47c7da92 Category: Brand:

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Product Detailed Parameters

  • Description:IC PROM SRL 1.8V 16M 48CSBGA
  • Series:-
  • Mfr:AMD
  • Package:Tray
  • Programmable Type:In System Programmable
  • Memory Size:16Mb
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:48-TFBGA, CSPBGA
  • Supplier Device Package:48-CSP (8x9)

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XCF16PFS48C

Buying Guide
Summary

AMD XCF16PFS48C is used in Configuration PROMs for FPGAs category where integration and verification need to stay predictable. Key specs include Description (IC PROM SRL 1.8V 16M 48CSBGA), Packaging (Tray), Supply (1.65V ~ 2V), Temperature (-40°C ~ 85°C), and Package/case (48-TFBGA, CSPBGA).

Selection Notes
  • For XCF16PFS48C, ensure the package/case (48-TFBGA, CSPBGA) and land pattern match your PCB layout before procurement.
  • Ensure the supply range (1.65V ~ 2V) is compatible with your power tree and tolerance budget.
  • Confirm the memory size (16Mb) meets your data logging and storage capacity targets.
  • Validate the operating temperature range (-40°C ~ 85°C) for your environment and margin.
Alternates & Substitutions
  • For Configuration PROMs for FPGAs substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Verify the alternate stays within supply 1.65V ~ 2V, temperature -40°C ~ 85°C across startup, load steps, and worst-case temperature.
  • Start by confirming the physical match (package/case 48-TFBGA, CSPBGA, supplier package 48-CSP (8x9), mounting Surface Mount) so the swap does not create a footprint risk.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
FAQ

What details help you quote XCF16PFS48C quickly?
Provide the part number (XCF16PFS48C), quantity, required lead time, and any packaging or documentation requirements.

Who is the manufacturer of XCF16PFS48C?
AMD

How is XCF16PFS48C supplied (packaging)?
Tray

What Programmable Type does XCF16PFS48C have?
In System Programmable

Application Scenarios

For AMD XCF16PFS48C in the Configuration PROMs for FPGAs category, teams usually prioritize documentation clarity and repeatable behavior in production. They are generally used when timing closure and interface robustness need to be provable on the bench and repeatable in production. Teams often choose simple logic to keep failure modes bounded and test cases straightforward during bring-up and qualification. Across aerospace electronics, predictable propagation and stable thresholds support qualification evidence. In high-speed boards, careful logic placement reduces trace length, improves SI, and lowers the risk of sporadic timing failures. Across industrial test equipment, logic blocks coordinate triggers and parallel capture inside shielded instruments that must repeat measurements across units. Once integration risk is understood, teams validate the same constraints under the actual enclosure, cabling, and power conditions. In production builds, the emphasis shifts to repeatable testing, predictable failure modes, and stable behavior across lots.

Compatibility Advice
  • In practice, validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided before committing to volume builds.
  • With the final enclosure and cabling, validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided. This helps field behavior stay predictable across lots.
Project Fit
  • Best fit for Configuration PROMs for FPGAs when you can validate ESD and hot-plug behavior at cable entry points so stress does not create intermittent faults. Key checks often include configuration.
XCF16PFS48CXCF16PFS48C

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