10AS016E3F29I1SG

10AS016E3F29I1SG

  • Description:IC SOC CORTEX-A9 1.5GHZ 780FBGA
  • Series:Arria 10 SX

SKU:3e2c5cfd3859 Category: Brand:

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Product Detailed Parameters

  • Description:IC SOC CORTEX-A9 1.5GHZ 780FBGA
  • Series:Arria 10 SX
  • Mfr:Altera
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, POR, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz
  • Primary Attributes:FPGA - 160K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-FBGA, FC (29x29)

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10AS016E3F29I1SG

Buying Guide
Summary

Altera 10AS016E3F29I1SG is used in System On Chip (SoC) category where integration and verification need to stay predictable. Key specs include Description (IC SOC CORTEX-A9 1.5GHZ 780FBGA), Series (Arria 10 SX), Packaging (Tray), Temperature (-40°C ~ 100°C (TJ)), and Package/case (780-BBGA, FCBGA).

Selection Notes
  • For 10AS016E3F29I1SG, double-check the package/case (780-BBGA, FCBGA) and recommended land pattern before ordering.
  • Confirm the operating temperature range (-40°C ~ 100°C (TJ)) meets your deployment conditions.
  • Confirm Primary Attributes (FPGA - 160K Logic Elements) and ensure it matches your integration requirements.
  • Confirm Architecture (MCU, FPGA) meets your design constraints and system-level expectations.
Alternates & Substitutions
  • In System On Chip (SoC) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Confirm the real operating corners (temperature -40°C ~ 100°C (TJ)) and avoid swaps that only work at typical conditions.
  • Keep the assembly and footprint constraints consistent (package/case 780-BBGA, FCBGA, supplier package 780-FBGA, FC (29x29), packaging Tray) to avoid a late PCB change.
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
FAQ

What should I verify before using 10AS016E3F29I1SG in production?
Confirm footprint/pinout, min/max ratings, operating temperature, and the datasheet test conditions behind key specifications.

What is the Primary Attributes of 10AS016E3F29I1SG?
FPGA - 160K Logic Elements

Can you confirm the Speed for 10AS016E3F29I1SG?
1.5GHz

Which Peripherals is listed for 10AS016E3F29I1SG?
DMA, POR, WDT

Application Scenarios

When sourcing Altera 10AS016E3F29I1SG for System On Chip (SoC), engineers typically focus on de-risking integration and keeping validation repeatable. In practice, well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Within consumer electronics, integration reduces BOM and speeds product iterations while maintaining stable user experience. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Across building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. This is why the following scenarios matter: they reflect the environmental and integration stresses that dominate outcomes. From an engineering workflow standpoint, this is where bench validation and field constraints meet.

Compatibility Advice
  • For compatibility, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds. This keeps integration from depending on typical-only conditions.
Project Fit
  • Best fit for System On Chip (SoC) when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
10AS016E3F29I1SG10AS016E3F29I1SG

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