98-0229

98-0229

  • Description:IC CURRENT SENSE 8SOIC
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tube

SKU:4c57c983598d Category: Brand:

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Product Detailed Parameters

  • Description:IC CURRENT SENSE 8SOIC
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tube
  • Function:Current Sense
  • Sensing Method:-
  • Accuracy:-
  • Voltage - Input:9.5V ~ 20V
  • Current - Output:1mA
  • Operating Temperature:-40°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOIC

Download product information

98-0229

Buying Guide
Summary

Infineon Technologies 98-0229 is an electronic component in Current Regulation/Management category. Key specs: description: IC CURRENT SENSE 8SOIC; packaging: Tube; supply: 9.5V ~ 20V; temperature: -40°C ~ 125°C; package/case: 8-SOIC (0.154", 3.90mm Width); mounting: Surface Mount.

Selection Notes
  • For 98-0229, confirm package/case 8-SOIC (0.154", 3.90mm Width), mounting Surface Mount to ensure footprint compatibility.
  • For 98-0229, validate the operating temperature range (-40°C ~ 125°C) against your environment.
  • For 98-0229, check the supply voltage requirement (9.5V ~ 20V) and any rail tolerance constraints.
FAQ

What should I provide for an accurate quote for 98-0229?
Send the part number (98-0229), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 98-0229?
Infineon Technologies

What is the package/case of 98-0229?
8-SOIC (0.154", 3.90mm Width)

What is the mounting type of 98-0229?
Surface Mount

Application Scenarios
Infineon Technologies 98-0229 is listed under the Current Regulation/Management category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. In networking hardware, specialized parts reduce re-spin risk by providing proven behavior in dense racks. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
98-022998-0229

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