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The trend of science and technology is changing rapidly.
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by leading semiconductor manufacturers. According to the latest data from TrendForce, NAND flash contract prices jumped by as much as 50% month-over-month in November 2025, while DRAM prices rose by over 35%—marking the steepest quarterly increase since 2018.
AI Data Centers Fuel “Memory Super Cycle”
The primary catalyst behind the surge is the explosive build-out of AI data centers worldwide. Hyperscalers—including Microsoft, Amazon Web Services, Google Cloud, and Meta—are aggressively deploying next-generation AI servers that require significantly more high-bandwidth memory and storage than traditional systems.
“An AI training server now consumes up to 8× more DRAM and 3× more NAND than a standard cloud server,” said Avril Wu, Vice President at TrendForce. “This isn’t just incremental growth—it’s a structural shift in memory architecture.”
As a result, Samsung Electronics, SK hynix, and Micron Technology have collectively redirected over 70% of their advanced-node wafer capacity toward high-margin segments:
This pivot has drastically reduced output of legacy products like DDR4 and consumer-grade TLC NAND, triggering shortages across PCs, smartphones, and client SSDs.
NAND Market Hits Critical Inflection Point
Western Digital and Kioxia—despite recent operational improvements at their Japanese fabs—have confirmed they will not increase consumer NAND output in Q1 2026. Instead, both companies are prioritizing high-density enterprise SSDs (up to 122TB) for hyperscaler contracts.
Retail SSD prices have responded sharply:
“Inventory levels at channel partners are at historic lows,” noted IDC analyst Sanjay Hudait. “We expect spot shortages to persist through at least Q2 2026.”
DRAM: LPDDR4 Fades as LPDDR5 Dominates Mobile Landscape
In the mobile segment, SK hynix and Micron have nearly ceased production of LPDDR4 chips. TrendForce reports that LPDDR5/X now accounts for 73% of total mobile DRAM shipments in Q4 2025, up from 60% a year ago.
Apple’s iPhone 17 Pro models (expected late 2025) and flagship Android devices from Samsung and Google are expected to adopt LPDDR5X-9600, further tightening supply for mid-tier smartphones still reliant on older standards.
Outlook: No Relief Before Mid-2026
All three major DRAM suppliers have signaled that the current allocation strategy will remain in place through at least the first half of 2026. With HBM4 mass production set to begin in early 2026—and already fully booked by NVIDIA and AMD—the imbalance between enterprise and consumer memory supply is expected to widen.
“Consumers should brace for higher device costs,” said Gartner senior research director Joseph Unsworth. “This isn’t a temporary blip. We’re in the early innings of a multi-year AI-driven memory supercycle.”
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Samsung's HBM3E chips have passed NVIDIA's certification, and SK Hynix has completed the development of HBM4 chips.
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