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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
---|---|---|---|---|---|---|---|
![]() PSS25SA2FT $31.42000 | Powerex Inc. | MOD IPM 6-PAC 25A 1200V DIP | Tray | Through Hole | - | ||
![]() PSS30S71F6 $21.52000 | Powerex Inc. | MOD IPM 6-PAC 30A 600V DIP | Tube | Through Hole | - | ||
![]() PSS30S92F6-AG $18.50000 | Powerex Inc. | MOD IPM 6-PAC 30A 600V DIP | Tube | Through Hole | - | ||
![]() PSS35S92F6-AG $21.12000 | Powerex Inc. | MOD IPM 6-PAC 35A 600V DIP | Tray | Through Hole | - | ||
![]() PSS35SA2FT $40.70000 | Powerex Inc. | MOD IPM 6-PAC 35A 1200V DIP | Tray | Through Hole | - | ||
![]() PSS50S71F6 $27.21000 | Powerex Inc. | MOD IPM 6-PAC 50A 600V DIP | Tube | Through Hole | - | ||
![]() PSS50SA2FT $55.11000 | Powerex Inc. | MOD IPM 6-PAC 50A 1200V DIP | Tray | Through Hole | - | ||
![]() STGIB10CH60S-L $5.21000 | STMicroelectronics | SLLIMM 2ND SERIES IPM, 3-PHASE I | Tube | Through Hole | SLLIMM™ |