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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
---|---|---|---|---|---|---|---|
STMicroelectronics | PWR MODULE 600V 30A 38-POWERDIP | Tube | Through Hole | SLLIMM™ | |||
![]() STGIPL30C60-H $12.75000 | STMicroelectronics | MOD IPM SLLIMM 8PHASE 38SDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPL35K120L1 $23.72000 | STMicroelectronics | POWER DRIVER IGBT 1200V SDIP-18L | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPN3H60 $8.57000 | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Tube | Through Hole | SLLIMM™ | ||
STMicroelectronics | PWR MODULE 600V 3A 26-POWERDIP | Tube | Through Hole | SLLIMM™ | |||
![]() STGIPN3H60-H $7.82000 | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPN3H60A $8.22000 | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPN3H60AT $8.27000 | STMicroelectronics | IGBT BIPO 600V 3A DIP | Tube | Through Hole | SLLIMM™ |