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— 葡萄酒 | 威士忌 | 白兰地 | 啤酒 —
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— 葡萄酒 | 威士忌 | 白兰地 | 啤酒 —
Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
 STGIPN3H60T-H $8.27000 | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Tube | Through Hole | SLLIMM™ | ||
 STGIPN3HD60-H $3.19000 | STMicroelectronics | SLLIMM-NANO SMALL LOW-LOSS INTEL | Tube | Through Hole | SLLIMM™ | ||
 STGIPNS3H60T-H $8.08000 | STMicroelectronics | SLLIMM-NANO SMALL LOW-LOSS INTEL | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | SLLIMM™ | ||
STGIPNS3HD60-H $8.00000 | STMicroelectronics | SLLIMM-NANO SMALL LOW-LOSS INTEL | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | SLLIMM™ | ||
STGIPNS4C60T-H $8.00000 | STMicroelectronics | SLLIMM NANO IPM, 5 A, 600 V, 3-P | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | ECOPACK® | ||
| STMicroelectronics | PWR MODULE 600V 3A 26DIP | Tube | Through Hole | SLLIMM™ | |||
 STGIPQ3H60T-HZS $5.84000 | STMicroelectronics | PWR MODULE 600V 3A 26DIP | Tube | Through Hole | SLLIMM™ | ||
STGIPQ3HD60-HL $3.61000 | STMicroelectronics | SLLIMM-NANO 2ND SERIES IPM, 3 A, | Tube | Through Hole | SLLIMM™ |
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