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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
---|---|---|---|---|---|---|---|
![]() AOZ5537QI $2.64000 | Alpha & Omega Semiconductor Inc. | POWER IC DRMOS | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | - | ||
![]() AOZ5636QI $2.26000 | Alpha & Omega Semiconductor Inc. | POWER IC DRMOS | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | - | ||
![]() APTLGF300A1208G $236.05000 | Microsemi Corporation | POWER MOD IGBT PHASE LEG LP8 | Bulk | Through Hole | - | ||
![]() APTLGF350A608G $193.32000 | Microchip Technology | POWER MOD INTELLIGENT PH LEG LP8 | Bulk | Through Hole | - | ||
![]() APTLGL325A1208G $517.97000 | Microchip Technology | POWER MOD INTELLIGENT PH LEG LP8 | Bulk | Through Hole | - | ||
![]() APTLGT300A1208G $530.60000 | Microchip Technology | MOD IGBT 1200V 440A LP8 | Bulk | Through Hole | - | ||
![]() APTLGT400A608G $461.41000 | Microchip Technology | POWER MOD INTELLIGENT PH LEG LP8 | Bulk | Through Hole | - | ||
![]() BM63363S-VA $14.15000 | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Tube,Tube | Through Hole | - |