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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
---|---|---|---|---|---|---|---|
![]() FF55MR12W1M1HB11BPSA1 $34.91000 | Infineon Technologies | EASYDUAL MODULE WITH COOLSIC TRE | Tray | - | - | ||
![]() FF55MR12W1M1HB70BPSA1 $53.85000 | Infineon Technologies | EASYDUAL MODULE WITH COOLSIC TRE | Tray | - | - | ||
![]() FF900R12ME7WBPSA1 $197.42000 | Infineon Technologies | FF900R12ME7WBPSA1 | Tray | - | - | ||
![]() FNA21012A $30.98000 | onsemi | MODULE SPM 1.2V 10A 34PWRDIP | Tube,Tube | Through Hole | Motion SPM® 2 | ||
![]() FNA22512A $55.71000 | onsemi | MODULE SPM 1.2KV 25A 34PWRDIP | Tube | Through Hole | Motion SPM® 2 | ||
onsemi | MODULE SPM 600V 30A 34PWRDIP | Tube | Through Hole | Motion SPM® 2 | |||
onsemi | MODULE SPM 1.2V 35A 34PWRDIP | Tube | Through Hole | Motion SPM® 2 | |||
![]() FNA25012A $59.93000 | onsemi | IPM SPM34 1200V 50A | Tube | Through Hole | Motion SPM® 2 |