03N06

03N06

$0.31
  • Description:N60V,RD(MAX)<100M@10V,RD(MAX)<12
  • Series:TrenchFET®
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:9a1f9ab44d1a Category: Brand:

  
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Product Detailed Parameters

  • Description:N60V,RD(MAX)<100M@10V,RD(MAX)<12
  • Series:TrenchFET®
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):60 V
  • Current - Continuous Drain (Id) @ 25°C:3A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
  • Rds On (Max) @ Id, Vgs:80mOhm @ 2A, 10V
  • Vgs(th) (Max) @ Id:1.2V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:14.6 nC @ 10 V
  • Vgs (Max):±20V
  • Input Capacitance (Ciss) (Max) @ Vds:458 pF @ 30 V
  • FET Feature:-
  • Power Dissipation (Max):1.7W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:SOT-23
  • Package / Case:TO-236-3, SC-59, SOT-23-3

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03N06

Buying Guide
Summary

Goford Semiconductor 03N06 is sourced in Single FETs, MOSFETs category when teams want clear constraints and a repeatable validation path. Key specs include Description (N60V, RD MAX <100M@10V, RD MAX <12), Series (TrenchFET®), Packaging (Tape & Reel (TR), Cut Tape (CT)), Temperature (-55°C ~ 150°C (TJ)), and Package/case (TO-236-3, SC-59, SOT-23-3).

Selection Notes
  • For 03N06, confirm the operating temperature range (-55°C ~ 150°C (TJ)) meets your deployment conditions.
  • Verify Vgs(th) (Max) @ Id (1.2V @ 250µA) matches your requirements and the datasheet test conditions.
  • Confirm the mounting type (Surface Mount) matches your assembly process and reliability requirements.
Alternates & Substitutions
  • Treat substitutions as a validation task: check limits, then re-test the assumptions that mattered in your bring-up.
  • When evaluating alternates, treat package/case TO-236-3, SC-59, SOT-23-3, supplier package SOT-23, mounting Surface Mount as non-negotiable unless you are re-spinning the PCB.
  • When in doubt, treat the swap as an ECO: define acceptance criteria, then validate under worst-case operating corners.
  • If you need a second source, provide (package TO-236-3, SC-59, SOT-23-3) and we will suggest options to evaluate under a clear test plan.
FAQ

Can you confirm the Technology for 03N06?
MOSFET (Metal Oxide)

What is the Drain to Source Voltage (Vdss) of 03N06?
60 V

Which packaging format is listed for 03N06?
Tape & Reel (TR), Cut Tape (CT)

What Input Capacitance (Ciss) (Max) @ Vds does 03N06 have?
458 pF @ 30 V

Application Scenarios

Within practice, the question for Goford Semiconductor 03N06 in Single FETs, MOSFETs is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. Engineers often treat gate drive, layout, and SOA as system-level constraints because they dominate switching behavior and EMI. A robust switch choice reduces field risk by keeping thermal margins and fault behavior stable across production variance. Design teams typically favor switches with clear SOA and repeatable behavior because it simplifies protection design and validation. In industrial power stages, device choices are validated for SOA margins and thermal rise under realistic waveforms. In automotive modules, MOSFETs tolerate transients and inductive kickback while meeting EMI constraints on dense harnessed systems. Within DC-DC converters and load switches, MOSFET selection sets efficiency and thermal headroom, and layout strongly influences ringing and EMI.

Compatibility Advice
  • Verify interface levels and timing margins against the host so integration does not depend on typical-only conditions before freezing the BOM.
  • Confirm the system entry points and stress models (hot-plug, surge, ESD) so protection and grounding assumptions match the real deployment with the real source, load, and wiring.
  • To reduce integration risk, verify tolerance stack-up and assembly constraints so mechanical fit does not depend on fragile adjustments. This helps field behavior stay predictable across lots.
Project Fit
  • Ideal when you can measure and verify Goford Semiconductor 03N06 for Single FETs, MOSFETs integration in the final enclosure, especially if you want measurable acceptance criteria for production test.
  • A practical check is to define acceptance criteria and validate the key assumptions in the final enclosure before approving substitutions.
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