06N06L

06N06L

$0.05
  • Description:MOSFET N-CH 60V 5.5A SOT-23-3L
  • Series:TrenchFET®
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR)

SKU:1a435af1fcbd Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MOSFET N-CH 60V 5.5A SOT-23-3L
  • Series:TrenchFET®
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR)
  • FET Type:N-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):-
  • Current - Continuous Drain (Id) @ 25°C:5.5A
  • Drive Voltage (Max Rds On, Min Rds On):-
  • Rds On (Max) @ Id, Vgs:42mOhm @ 3A, 10V
  • Vgs(th) (Max) @ Id:2.5V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:-
  • Vgs (Max):±20V
  • Input Capacitance (Ciss) (Max) @ Vds:765 pF @ 30 V
  • FET Feature:-
  • Power Dissipation (Max):960mW
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:SOT-23-3
  • Package / Case:TO-236-3, SC-59, SOT-23-3

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06N06L

Buying Guide
Summary

Goford Semiconductor 06N06L is used in Single FETs, MOSFETs category where integration and verification need to stay predictable. Key specs include Description (MOSFET N-CH 60V 5.5A SOT-23-3L), Series (TrenchFET®), Packaging (Tape & Reel (TR)), Temperature (-55°C ~ 150°C (TJ)), and Package/case (TO-236-3, SC-59, SOT-23-3).

Selection Notes
  • For 06N06L, check Current - Continuous Drain (Id) @ 25°C (5.5A) against the datasheet conditions and your system-level constraints.
  • Verify the package/case (TO-236-3, SC-59, SOT-23-3) fits your mechanical constraints and assembly process.
  • Make sure the supply current (5.5A) fits your power budget in all modes.
Alternates & Substitutions
  • For Single FETs, MOSFETs substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Lock the mechanical constraints first (package/case TO-236-3, SC-59, SOT-23-3, supplier package SOT-23-3, mounting Surface Mount) before comparing performance specs.
  • If you are qualifying a second source, align documentation/traceability requirements early to avoid surprises in procurement.
  • If you need a second source, provide (package TO-236-3, SC-59, SOT-23-3) and we will suggest options to evaluate under a clear test plan.
FAQ

How do I confirm compatibility for 06N06L?
Match mechanical footprint first, then verify electrical limits and operating conditions against your system constraints.

Can you confirm the Input Capacitance (Ciss) (Max) @ Vds for 06N06L?
765 pF @ 30 V

What Rds On (Max) @ Id, Vgs does 06N06L have?
42mOhm @ 3A, 10V

What package/case is listed for 06N06L?
TO-236-3, SC-59, SOT-23-3

Application Scenarios

In many Single FETs, MOSFETs builds, Goford Semiconductor 06N06L is reviewed for predictable behavior, supportability, and stable qualification evidence. They switch or control current and voltage, enabling load control, power conversion, and signal conditioning at the component level. In real deployments, selection focuses on operating envelope (breakdown voltage/current), conduction loss, switching behavior, package parasitics, and thermal impedance under realistic waveforms. In outdoor equipment, derating and PCB heat spreading determine long-term reliability under harsh environments. In real deployments, across automotive modules, MOSFETs tolerate transients and inductive kickback while meeting EMI constraints on dense harnessed systems. In DC-DC converters and load switches, MOSFET selection sets efficiency and thermal headroom, and layout strongly influences ringing and EMI. Engineers typically treat gate drive, layout, and SOA as system-level constraints because they dominate switching behavior and EMI.

Compatibility Advice
  • To keep validation repeatable, confirm turn-off behavior under worst-case inductance so overshoot stays bounded without relying on lucky wiring. This keeps integration from depending on typical-only conditions.
  • For production stability, confirm SOA and transient margins under the real waveform, because layout and inductance decide peak stress during bring-up and production test.
  • In practice, confirm package and mounting constraints so parasitics remain consistent across assembly variance before release to production.
Project Fit
  • Ideal when you can qualify Goford Semiconductor 06N06L for Single FETs, MOSFETs integration across temperature and supply corners, and you can validate switching transitions, snubbers, and thermal rise under the real load waveform.
  • Usually not a good fit when integrating Goford Semiconductor 06N06L for Single FETs, MOSFETs, layout and parasitics cannot be controlled enough to keep transient stress predictable, because the behavior cannot be verified in a repeatable way.
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