100-1217-1

100-1217-1

$364.65
  • Description:IC MOD ADSP-BF609 500MHZ X 2
  • Series:Blackfin®

SKU:40676258b682 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MOD ADSP-BF609 500MHZ X 2
  • Series:Blackfin®
  • Mfr:BECOM Systems GmbH
  • Package:Tape & Reel (TR)
  • Module/Board Type:MPU Core
  • Core Processor:ADSP-BF609 (Dual Core)
  • Co-Processor:-
  • Speed:500MHz x 2
  • Flash Size:8MB
  • RAM Size:256KB
  • Connector Type:Expansion 2 x 100
  • Size / Dimension:1.730" L x 1.300" W (44.00mm x 33.00mm)
  • Operating Temperature:0°C ~ 70°C

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100-1217-1

Buying Guide
Summary

BECOM Systems GmbH 100-1217-1 is an electronic component in Microcontrollers, Microprocessor, FPGA Modules category. Key specs: core: ADSP-BF609 (Dual Core); speed: 500MHz x 2; RAM: 256KB; temperature: 0°C ~ 70°C; packaging: Tape & Reel (TR); description: IC MOD ADSP-BF609 500MHZ X 2.

Selection Notes
  • For 100-1217-1, validate the operating temperature range (0°C ~ 70°C) against your environment.
  • For 100-1217-1, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (series Blackfin®; packaging Tape & Reel (TR)).
  • For 100-1217-1, confirm packaging option and moisture sensitivity handling if your assembly process requires it (temperature 0°C ~ 70°C; series Blackfin®).
FAQ

What information do you need to quote 100-1217-1?
Send the part number (100-1217-1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 100-1217-1?
BECOM Systems GmbH

What is the operating temperature range of 100-1217-1?
0°C ~ 70°C

What is the core processor of 100-1217-1?
ADSP-BF609 (Dual Core)

Application Scenarios
In the Microcontrollers, Microprocessor, FPGA Modules category, BECOM Systems GmbH 100-1217-1 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
100-1217-1100-1217-1
$364.65
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