100-1218-1

100-1218-1

$333.54
  • Description:IC MOD ADSP-BF609 500MHZ X 2
  • Series:Blackfin®

SKU:f076ae16f24f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MOD ADSP-BF609 500MHZ X 2
  • Series:Blackfin®
  • Mfr:BECOM Systems GmbH
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Module/Board Type:MPU Core
  • Core Processor:ADSP-BF609 (Dual Core)
  • Co-Processor:-
  • Speed:500MHz x 2
  • Flash Size:8MB
  • RAM Size:256KB
  • Connector Type:Expansion 2 x 100
  • Size / Dimension:1.730" L x 1.300" W (44.00mm x 33.00mm)
  • Operating Temperature:-40°C ~ 85°C

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100-1218-1

Buying Guide
Summary

BECOM Systems GmbH 100-1218-1 is an electronic component in Microcontrollers, Microprocessor, FPGA Modules category. Key specs: core: ADSP-BF609 (Dual Core); speed: 500MHz x 2; RAM: 256KB; temperature: -40°C ~ 85°C; packaging: Tape & Reel (TR),Cut Tape (CT); description: IC MOD ADSP-BF609 500MHZ X 2.

Selection Notes
  • For 100-1218-1, validate the operating temperature range (-40°C ~ 85°C) against your environment.
  • For 100-1218-1, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (temperature -40°C ~ 85°C; series Blackfin®).
  • For 100-1218-1, if this is for production, consider sourcing and lifecycle risk (second source / availability) (packaging Tape & Reel (TR),Cut Tape (CT); temperature -40°C ~ 85°C).
FAQ

How can I request a quote for 100-1218-1?
Send the part number (100-1218-1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 100-1218-1?
BECOM Systems GmbH

What is the packaging of 100-1218-1?
Tape & Reel (TR),Cut Tape (CT)

What is the operating temperature range of 100-1218-1?
-40°C ~ 85°C

Application Scenarios
BECOM Systems GmbH 100-1218-1 is listed under the Microcontrollers, Microprocessor, FPGA Modules category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
100-1218-1100-1218-1
$333.54
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