100-1471-2

100-1471-2

  • Description:IC MODULE CM-I.MX53 1GHZ 1GB
  • Series:i.MX

SKU:525bd588fa2b Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CM-I.MX53 1GHZ 1GB
  • Series:i.MX
  • Mfr:BECOM Systems GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:CM-i.MX53
  • Co-Processor:-
  • Speed:1GHz
  • Flash Size:2GB (NAND), 4MB (NOR)
  • RAM Size:1GB
  • Connector Type:Expansion 3 x 100
  • Size / Dimension:3.150" L x 1.770" W (80.00mm x 45.00mm)
  • Operating Temperature:0°C ~ 70°C

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100-1471-2

Buying Guide
Summary

BECOM Systems GmbH 100-1471-2 is an electronic component in Microcontrollers, Microprocessor, FPGA Modules category. Key specs: core: CM-i.MX53; speed: 1GHz; RAM: 1GB; temperature: 0°C ~ 70°C; packaging: Bulk; description: IC MODULE CM-I.MX53 1GHZ 1GB.

Selection Notes
  • For 100-1471-2, validate the operating temperature range (0°C ~ 70°C) against your environment.
  • For 100-1471-2, if this is for production, consider sourcing and lifecycle risk (second source / availability) (packaging Bulk; temperature 0°C ~ 70°C).
  • For 100-1471-2, review the latest datasheet revision and confirm key electrical characteristics for your use case (temperature 0°C ~ 70°C; series i.MX).
FAQ

What information do you need to quote 100-1471-2?
Send the part number (100-1471-2), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 100-1471-2?
BECOM Systems GmbH

What is the operating temperature range of 100-1471-2?
0°C ~ 70°C

What is the core processor of 100-1471-2?
CM-i.MX53

Application Scenarios
In the Microcontrollers, Microprocessor, FPGA Modules category, BECOM Systems GmbH 100-1471-2 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
100-1471-2100-1471-2

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