10AS016E3F27I2SG

10AS016E3F27I2SG

$891.09
  • Description:IC SOC CORTEX-A9 1.5GHZ 672FBGA
  • Series:Arria 10 SX

SKU:ba3b2eb3fc08 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A9 1.5GHZ 672FBGA
  • Series:Arria 10 SX
  • Mfr:Altera
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, POR, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz
  • Primary Attributes:FPGA - 160K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:672-BBGA, FCBGA
  • Supplier Device Package:672-FBGA, FC (27x27)

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10AS016E3F27I2SG

Buying Guide
Summary

Altera 10AS016E3F27I2SG is sourced in System On Chip (SoC) category when teams want clear constraints and a repeatable validation path. Key specs include Description (IC SOC CORTEX-A9 1.5GHZ 672FBGA), Series (Arria 10 SX), Packaging (Tray), Temperature (-40°C ~ 100°C (TJ)), and Package/case (672-BBGA, FCBGA).

Selection Notes
  • For 10AS016E3F27I2SG, verify the operating temperature range (-40°C ~ 100°C (TJ)) and derate as needed in your application.
  • Validate Primary Attributes (FPGA - 160K Logic Elements) under the expected test conditions in your application.
  • Confirm the package/case (672-BBGA, FCBGA) matches your PCB footprint and land pattern.
  • Verify Architecture (MCU, FPGA) and compare it against your reference design limits.
Alternates & Substitutions
  • In System On Chip (SoC) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Make sure the alternate stays inside your system envelope: temperature -40°C ~ 100°C (TJ).
  • Confirm compliance/qualification needs (for example RoHS/REACH or grade) before approving a second source for production.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
FAQ

What details help you quote 10AS016E3F27I2SG quickly?
Share the part number (10AS016E3F27I2SG), quantity, target delivery date, and any packaging or documentation requirements.

Can you confirm the RAM Size for 10AS016E3F27I2SG?
256KB

What is the Supplier Device Package of 10AS016E3F27I2SG?
672-FBGA, FC (27x27)

What is the Peripherals of 10AS016E3F27I2SG?
DMA, POR, WDT

Application Scenarios

In practice, altera 10AS016E3F27I2SG in the System On Chip (SoC) category is typically selected when engineers need predictable, spec-driven behavior in a production design. In practice, selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In practice, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Within IoT deployments, low power and secure boot support long-life outdoor operation. Within automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. Across IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. Within medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability.

Compatibility Advice
  • Before committing to volume builds, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable. This avoids one-off tuning in production.
Project Fit
  • Ideal when you can measure and verify Altera 10AS016E3F27I2SG for System On Chip (SoC) integration across temperature and supply corners, especially if you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
10AS016E3F27I2SG10AS016E3F27I2SG
$891.09
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