10AS016E3F29I1HG

10AS016E3F29I1HG

$1,094.74
  • Description:IC SOC CORTEX-A9 1.5GHZ 780FBGA
  • Series:Arria 10 SX

SKU:0ae55c83bac1 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SOC CORTEX-A9 1.5GHZ 780FBGA
  • Series:Arria 10 SX
  • Mfr:Altera
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, POR, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.5GHz
  • Primary Attributes:FPGA - 160K Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-FBGA, FC (29x29)

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10AS016E3F29I1HG

Buying Guide
Summary

Altera 10AS016E3F29I1HG is sourced in System On Chip (SoC) category when teams want clear constraints and a repeatable validation path. Key specs include Description (IC SOC CORTEX-A9 1.5GHZ 780FBGA), Series (Arria 10 SX), Packaging (Tray), Temperature (-40°C ~ 100°C (TJ)), and Package/case (780-BBGA, FCBGA).

Selection Notes
  • For 10AS016E3F29I1HG, verify Primary Attributes (FPGA - 160K Logic Elements) matches your requirements and the datasheet test conditions.
  • Ensure the package/case (780-BBGA, FCBGA) and land pattern match your PCB layout before procurement.
  • Validate the operating temperature range (-40°C ~ 100°C (TJ)) for your environment and margin.
  • Check Architecture (MCU, FPGA) against the datasheet conditions and your system-level constraints.
Alternates & Substitutions
  • In System On Chip (SoC) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Make sure the alternate stays inside your system envelope: temperature -40°C ~ 100°C (TJ).
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
  • Confirm startup states and fault behavior are equivalent so the alternate does not change system behavior during brownouts or resets.
FAQ

How do I confirm compatibility for 10AS016E3F29I1HG?
Match mechanical footprint first, then verify electrical limits and operating conditions against your system constraints.

What is the Primary Attributes of 10AS016E3F29I1HG?
FPGA - 160K Logic Elements

What RAM Size does 10AS016E3F29I1HG have?
256KB

What is the packaging of 10AS016E3F29I1HG?
Tray

Application Scenarios

When Altera 10AS016E3F29I1HG is used in System On Chip (SoC) designs, teams typically start by confirming interfaces, supply rails, operating envelope, and qualification expectations. They often sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In real deployments, well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In building automation, local compute keeps systems functional even when cloud connectivity is intermittent. Within consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • Before freezing the BOM, validate power-domain assumptions and decoupling near the pins so brownouts and erratic behavior do not appear at temperature corners. This avoids one-off tuning in production.
Project Fit
  • Good fit when you can bench-verify Altera 10AS016E3F29I1HG for System On Chip (SoC) integration with the real wiring and cabling, and you have defined I/O domain constraints and can validate mixed-voltage interfaces on assembled hardware.
  • Poor fit when boot and recovery behavior depends on sequencing or strapping that cannot be controlled across builds, because the behavior cannot be verified in a repeatable way.
10AS016E3F29I1HG10AS016E3F29I1HG
$1,094.74
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