11500R-5000

11500R-5000

$1.77
  • Description:IC INTERFACE SPECIALIZED 20QFN
  • Series:Pyxos™

SKU:7b9d8acb5c8f Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC INTERFACE SPECIALIZED 20QFN
  • Series:Pyxos™
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)
  • Applications:Networking
  • Interface:SPI
  • Voltage - Supply:3.3V
  • Package / Case:20-VQFN Exposed Pad
  • Supplier Device Package:20-QFN (5x5)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount

Download product information

11500R-5000

Buying Guide
Summary

Renesas Electronics Corporation 11500R-5000 is an electronic component in Specialized category. Key specs: description: IC INTERFACE SPECIALIZED 20QFN; series: Pyxos™; packaging: Tape & Reel (TR); supply: 3.3V; package/case: 20-VQFN Exposed Pad; mounting: Surface Mount.

Selection Notes
  • For 11500R-5000, confirm package/case 20-VQFN Exposed Pad, mounting Surface Mount to ensure footprint compatibility.
  • For 11500R-5000, check the supply voltage requirement (3.3V) and any rail tolerance constraints.
  • For 11500R-5000, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (supply 3.3V; series Pyxos™).
FAQ

What information do you need to quote 11500R-5000?
Send the part number (11500R-5000), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 11500R-5000?
Renesas Electronics Corporation

What is the packaging of 11500R-5000?
Tape & Reel (TR)

What is the package/case of 11500R-5000?
20-VQFN Exposed Pad

Application Scenarios
For Renesas Electronics Corporation 11500R-5000 in the Specialized category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They provide a focused function that reduces system integration risk and helps meet requirements in real deployments. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it simplifies bring-up and troubleshooting by making the design easier to validate and support in production.
11500R-500011500R-5000
$1.77
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