1B51BN

1B51BN

  • Description:IC THERMCPL SGNL COND ISOL 38DIP
  • Series:-

SKU:090239149b28 Category: Brand:

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Product Detailed Parameters

  • Description:IC THERMCPL SGNL COND ISOL 38DIP
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Type:Signal Conditioner
  • Input Type:Voltage
  • Output Type:Voltage
  • Current - Supply:12 mA
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Through Hole
  • Package / Case:38-DIP (0.800", 20.32mm), 12 Leads
  • Supplier Device Package:12-PDIP
  • Grade:-
  • Qualification:-

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1B51BN

Buying Guide
Summary

Analog Devices Inc. 1B51BN is an electronic component in Sensor and Detector Interfaces category. Key specs: description: IC THERMCPL SGNL COND ISOL 38DIP; type: Signal Conditioner; packaging: Tray; temperature: -40°C ~ 85°C; package/case: 38-DIP (0.800", 20.32mm), 12 Leads; mounting: Through Hole; output type: Voltage.

Selection Notes
  • For 1B51BN, confirm package/case 38-DIP (0.800", 20.32mm), 12 Leads, mounting Through Hole to ensure footprint compatibility.
  • For 1B51BN, validate the operating temperature range (-40°C ~ 85°C) against your environment.
  • For 1B51BN, match interface/output type (Voltage) when selecting alternatives or second sources.
FAQ

What information do you need to quote 1B51BN?
Send the part number (1B51BN), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1B51BN?
Analog Devices Inc.

What is the operating temperature range of 1B51BN?
-40°C ~ 85°C

What is the package/case of 1B51BN?
38-DIP (0.800", 20.32mm), 12 Leads

Application Scenarios
For Analog Devices Inc. 1B51BN in the Sensor and Detector Interfaces category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. Engineers focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. In handheld devices, compact RF building blocks reduce layout risk and speed compliance testing for emissions and susceptibility. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
1B51BN1B51BN

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