1SV239TPH3F

1SV239TPH3F

$0.26
  • Description:DIODE VARACTOR 15V USC
  • Series:-

SKU:9645fc21ce21 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE VARACTOR 15V USC
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Capacitance @ Vr, F:2pF @ 10V, 1MHz
  • Capacitance Ratio:2.4
  • Capacitance Ratio Condition:C2/C10
  • Voltage - Peak Reverse (Max):15 V
  • Diode Type:Single
  • Q @ Vr, F:-
  • Operating Temperature:125°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:SC-76, SOD-323
  • Supplier Device Package:USC

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1SV239TPH3F

Buying Guide
Summary

Toshiba Semiconductor and Storage 1SV239TPH3F is an electronic component in Variable Capacitance (Varicaps, Varactors) category. Key specs: description: DIODE VARACTOR 15V USC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: 125°C (TJ); package/case: SC-76, SOD-323; mounting: Surface Mount; frequency: 2pF @ 10V, 1MHz.

Selection Notes
  • For 1SV239TPH3F, confirm package/case SC-76, SOD-323, mounting Surface Mount to ensure footprint compatibility.
  • For 1SV239TPH3F, validate the operating temperature range (125°C (TJ)) against your environment.
  • For 1SV239TPH3F, confirm the operating frequency (2pF @ 10V, 1MHz) and any related tolerance requirements.
FAQ

What information do you need to quote 1SV239TPH3F?
Send the part number (1SV239TPH3F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1SV239TPH3F?
Toshiba Semiconductor and Storage

What is the operating frequency of 1SV239TPH3F?
2pF @ 10V, 1MHz

What is the packaging of 1SV239TPH3F?
Tape & Reel (TR),Cut Tape (CT)

Application Scenarios
Toshiba Semiconductor and Storage 1SV239TPH3F in the Variable Capacitance (Varicaps, Varactors) category is typically selected when engineers need predictable, spec-driven behavior in a production design. Biasing, thermal design, and output matching are treated as system-level problems, not just a schematic choice. Good RF building blocks accelerate certification and reduce re-spin risk in antenna-to-baseband designs. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, it improves predictability by keeping key performance stable across manufacturing variance and operating conditions.
1SV239TPH3F1SV239TPH3F
$0.26
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