1SV307(TPH3,F)

1SV307(TPH3,F)

$0.31
  • Description:RF DIODE PIN 30V USC
  • Series:-

SKU:dd00137b5eff Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:RF DIODE PIN 30V USC
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Diode Type:PIN - Single
  • Voltage - Peak Reverse (Max):30V
  • Current - Max:50 mA
  • Capacitance @ Vr, F:0.5pF @ 1V, 1MHz
  • Resistance @ If, F:1.5Ohm @ 10mA, 100MHz
  • Power Dissipation (Max):-
  • Operating Temperature:125°C (TJ)
  • Package / Case:SC-76, SOD-323
  • Supplier Device Package:USC
  • Grade:-
  • Qualification:-

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1SV307(TPH3,F)

Buying Guide
Summary

Toshiba Semiconductor and Storage 1SV307TPH3F is an electronic component in RF Diodes category. Key specs: description: RF DIODE PIN 30V USC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: 125°C (TJ); package/case: SC-76, SOD-323; frequency: 0.5pF @ 1V, 1MHz.

Selection Notes
  • For 1SV307TPH3F, confirm package/case SC-76, SOD-323 to ensure footprint compatibility.
  • For 1SV307TPH3F, validate the operating temperature range (125°C (TJ)) against your environment.
  • For 1SV307TPH3F, confirm the operating frequency (0.5pF @ 1V, 1MHz) and any related tolerance requirements.
FAQ

What information do you need to quote 1SV307TPH3F?
Send the part number (1SV307TPH3F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1SV307TPH3F?
Toshiba Semiconductor and Storage

What is the package/case of 1SV307TPH3F?
SC-76, SOD-323

What is the operating frequency of 1SV307TPH3F?
0.5pF @ 1V, 1MHz

Application Scenarios
For Toshiba Semiconductor and Storage 1SV307TPH3F in the RF Diodes category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. Engineers focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. In handheld devices, compact RF building blocks reduce layout risk and speed compliance testing for emissions and susceptibility. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, it improves predictability by keeping key performance stable across manufacturing variance and operating conditions.
1SV307(TPH3,F)1SV307(TPH3,F)
$0.31
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