1SV311(TPH3,F)

1SV311(TPH3,F)

$0.33
  • Description:DIODE VARACTOR 10V ESC
  • Series:-

SKU:91037a984063 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE VARACTOR 10V ESC
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Capacitance @ Vr, F:5.45pF @ 4V, 1MHz
  • Capacitance Ratio:2.1
  • Capacitance Ratio Condition:C1/C4
  • Voltage - Peak Reverse (Max):10 V
  • Diode Type:Single
  • Q @ Vr, F:-
  • Operating Temperature:125°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:SC-79, SOD-523
  • Supplier Device Package:ESC

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1SV311(TPH3,F)

Buying Guide
Summary

Toshiba Semiconductor and Storage 1SV311TPH3F is an electronic component in Variable Capacitance (Varicaps, Varactors) category. Key specs: description: DIODE VARACTOR 10V ESC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: 125°C (TJ); package/case: SC-79, SOD-523; mounting: Surface Mount; frequency: 5.45pF @ 4V, 1MHz.

Selection Notes
  • For 1SV311TPH3F, confirm package/case SC-79, SOD-523, mounting Surface Mount to ensure footprint compatibility.
  • For 1SV311TPH3F, validate the operating temperature range (125°C (TJ)) against your environment.
  • For 1SV311TPH3F, confirm the operating frequency (5.45pF @ 4V, 1MHz) and any related tolerance requirements.
FAQ

What should I provide for an accurate quote for 1SV311TPH3F?
Send the part number (1SV311TPH3F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1SV311TPH3F?
Toshiba Semiconductor and Storage

What is the package/case of 1SV311TPH3F?
SC-79, SOD-523

What is the mounting type of 1SV311TPH3F?
Surface Mount

Application Scenarios
Toshiba Semiconductor and Storage 1SV311TPH3F is listed under the Variable Capacitance (Varicaps, Varactors) category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. Their specifications directly influence link budget, sensitivity, selectivity, and emission margins in crowded spectrum environments. Biasing, thermal design, and output matching are treated as system-level problems, not just a schematic choice. In IoT gateways, matching and filtering improve sensitivity and coexistence in crowded 2.4 GHz and sub-GHz environments. In aerospace telemetry, predictable RF routing and isolation improve resilience to interference and maintain link margin over long distances. In industrial sensing, RF front ends support radar and presence detection where phase noise and filtering influence range accuracy. Overall, it simplifies bring-up and troubleshooting by making the design easier to validate and support in production.
1SV311(TPH3,F)1SV311(TPH3,F)
$0.33
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