1SV314(TPL3,F)

1SV314(TPL3,F)

$0.33
  • Description:DIODE VARACTOR 10V SINGLE ESC
  • Series:-

SKU:370b90dcbbe1 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DIODE VARACTOR 10V SINGLE ESC
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Capacitance @ Vr, F:3.4pF @ 2.5V, 1MHz
  • Capacitance Ratio:2.5
  • Capacitance Ratio Condition:C0.5/C2.5
  • Voltage - Peak Reverse (Max):10 V
  • Diode Type:Single
  • Q @ Vr, F:-
  • Operating Temperature:125°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:SC-79, SOD-523
  • Supplier Device Package:ESC

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1SV314(TPL3,F)

Buying Guide
Summary

Toshiba Semiconductor and Storage 1SV314TPL3F is an electronic component in Variable Capacitance (Varicaps, Varactors) category. Key specs: description: DIODE VARACTOR 10V SINGLE ESC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: 125°C (TJ); package/case: SC-79, SOD-523; mounting: Surface Mount; frequency: 3.4pF @ 2.5V, 1MHz.

Selection Notes
  • For 1SV314TPL3F, confirm package/case SC-79, SOD-523, mounting Surface Mount to ensure footprint compatibility.
  • For 1SV314TPL3F, validate the operating temperature range (125°C (TJ)) against your environment.
  • For 1SV314TPL3F, confirm the operating frequency (3.4pF @ 2.5V, 1MHz) and any related tolerance requirements.
FAQ

What information do you need to quote 1SV314TPL3F?
Send the part number (1SV314TPL3F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 1SV314TPL3F?
Toshiba Semiconductor and Storage

What is the operating frequency of 1SV314TPL3F?
3.4pF @ 2.5V, 1MHz

What is the packaging of 1SV314TPL3F?
Tape & Reel (TR),Cut Tape (CT)

Application Scenarios
For Toshiba Semiconductor and Storage 1SV314TPL3F in the Variable Capacitance (Varicaps, Varactors) category, engineers prioritize integration risk control, documentation, and repeatable performance in production. They shape RF performance by controlling gain, matching, filtering, routing, and isolation in high-frequency signal paths. Engineers focus on layout discipline, controlled impedance, grounding, and shielding to prevent spurs, desense, and compliance failures. Amplifier selection usually centers on noise figure, linearity (IP3), gain flatness, and stability across load mismatch. In handheld devices, compact RF building blocks reduce layout risk and speed compliance testing for emissions and susceptibility. In asset tracking, RFID elements must work near metal and liquids, so antenna and front-end choices determine real read range. In private LTE/5G and Wi-Fi infrastructure, RF stages operate in outdoor units exposed to humidity and thermal stress where stability affects throughput. Overall, it simplifies bring-up and troubleshooting by making the design easier to validate and support in production.
1SV314(TPL3,F)1SV314(TPL3,F)
$0.33
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