25CPC700BB3B66

25CPC700BB3B66

$47.11
  • Description:MEMORY CONTROLLER AND PCI BRIDGE
  • Series:IBM25PPC750FX
  • Mfr:IBM
  • Package:Bulk

SKU:45edcc2bc9bd Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MEMORY CONTROLLER AND PCI BRIDGE
  • Series:IBM25PPC750FX
  • Mfr:IBM
  • Package:Bulk
  • Controller Type:Dynamic RAM (DRAM)
  • Voltage - Supply:3.135V ~ 3.465V
  • Operating Temperature:-40°C ~ 105°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:474-BCBGA Exposed Pad
  • Supplier Device Package:474-CBGA (25x32)

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25CPC700BB3B66

Buying Guide
Summary

IBM 25CPC700BB3B66 is used in Controllers category where integration and verification need to stay predictable. Key specs include Description (MEMORY CONTROLLER AND PCI BRIDGE), Series (IBM25PPC750FX), Packaging (Bulk), Supply (3.135V ~ 3.465V), and Temperature (-40°C ~ 105°C (TJ)).

Selection Notes
  • For 25CPC700BB3B66, confirm the supply requirement (3.135V ~ 3.465V) is met during startup, transients, and brownout.
  • Confirm the operating temperature range (-40°C ~ 105°C (TJ)) meets your deployment conditions.
  • Check Controller Type (Dynamic RAM (DRAM)) against the datasheet conditions and your system-level constraints.
Alternates & Substitutions
  • For Controllers, treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Keep the assembly and footprint constraints consistent (package/case 474-BCBGA Exposed Pad, supplier package 474-CBGA (25x32), mounting Surface Mount) to avoid a late PCB change.
  • For production substitutions, confirm traceability and documentation expectations so the alternate can be released cleanly.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
FAQ

What should I compare when selecting an alternate for 25CPC700BB3B66?
Compare footprint/pinout, key electrical limits, temperature range, and interface requirements, then validate under worst-case conditions.

What Controller Type does 25CPC700BB3B66 have?
Dynamic RAM (DRAM)

Which Supplier Device Package is listed for 25CPC700BB3B66?
474-CBGA (25x32)

How is 25CPC700BB3B66 packaged?
Bulk

Application Scenarios

In real deployments, when IBM 25CPC700BB3B66 is used in Controllers designs, teams typically start by confirming interfaces, supply rails, operating envelope, and qualification expectations. They are generally frequently selected to keep the design spec-driven and repeatable when scaling from prototype to production. In many designs, the value is predictability: stable behavior across temperature, tolerance, and assembly variation. Once the interface and envelope are agreed, engineers focus on proving behavior on the actual PCB stack-up. In practice, within high-mix production, predictable parts reduce rework by keeping bring-up steps and measurements consistent across lots. In manufacturing, consistent behavior across lots improves yield because acceptance tests stay stable and measurable. Within long-life equipment, documented margins and qualification evidence reduce substitution risk over the product lifecycle. When a design is testable, it is also easier to support, troubleshoot, and evolve.

Compatibility Advice
  • Across temperature and supply corners, validate thermal headroom in the final enclosure so behavior stays stable after heat soak and airflow changes. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Ideal when you can bench-verify IBM 25CPC700BB3B66 for Controllers integration on the assembled PCB, and you care about repeatability and serviceability in fielded products.
  • Not ideal when integrating IBM 25CPC700BB3B66 for Controllers, requirements are still exploratory and change faster than qualification can follow, because the behavior cannot be verified in a repeatable way.
25CPC700BB3B6625CPC700BB3B66
$47.11
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