25EMPPC603E2BB200F

25EMPPC603E2BB200F

$27.00
  • Description:IC MPU 200MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk

SKU:2b1ebf0a58a8 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MPU 200MHZ 278FCPBGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk
  • Core Processor:PowerPC EM603e
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:200MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:2.5V, 3.3V
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:278-BBGA, FCBGA
  • Supplier Device Package:278-FCPBGA (21x21)
  • Additional Interfaces:-

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25EMPPC603E2BB200F

Buying Guide
Summary

IBM 25EMPPC603E2BB200F is an electronic component in Microprocessors category. Key specs: description: IC MPU 200MHZ 278FCPBGA; packaging: Bulk; temperature: 0°C ~ 105°C (TJ); package/case: 278-BBGA, FCBGA; mounting: Surface Mount.

Selection Notes
  • For 25EMPPC603E2BB200F, confirm package/case 278-BBGA, FCBGA, mounting Surface Mount to ensure footprint compatibility.
  • For 25EMPPC603E2BB200F, validate the operating temperature range (0°C ~ 105°C (TJ)) against your environment.
  • For 25EMPPC603E2BB200F, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (mounting Surface Mount; packaging Bulk).
FAQ

How can I request a quote for 25EMPPC603E2BB200F?
Send the part number (25EMPPC603E2BB200F), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 25EMPPC603E2BB200F?
IBM

What is the core processor of 25EMPPC603E2BB200F?
PowerPC EM603e

What is the packaging of 25EMPPC603E2BB200F?
Bulk

Application Scenarios
IBM 25EMPPC603E2BB200F is listed under the Microprocessors category and is commonly used when correctness, reliability, and qualification repeatability matter. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
25EMPPC603E2BB200F25EMPPC603E2BB200F
$27.00
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