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25PPC405CR-3BB200C

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

25PPC405CR-3BB200C

25PPC405CR-3BB200C

$40.48
  • Description：IC MPU 200MHZ 316EPBGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk

SKU:a550fa7cba7b Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC MPU 200MHZ 316EPBGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk
  • Core Processor：PowerPC 405CR
  • Number of Cores/Bus Width：1 Core, 32-Bit
  • Speed：200MHz
  • Co-Processors/DSP：-
  • RAM Controllers：SDRAM
  • Graphics Acceleration：No
  • Display & Interface Controllers：-
  • Ethernet：-
  • SATA：-
  • USB：-
  • Voltage - I/O：3.3V
  • Operating Temperature：-40°C ~ 85°C (TC)
  • Security Features：-
  • Mounting Type：Surface Mount
  • Package / Case：316-BBGA
  • Supplier Device Package：316-EPBGA (27x27)
  • Additional Interfaces：I2C, DMA, GPIO, UART

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25PPC405CR-3BB200C

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

IBM 25PPC405CR-3BB200C is selected in Microprocessors category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MPU 200MHZ 316EPBGA), Core (PowerPC 405CR), Speed (200MHz), Temperature (-40°C ~ 85°C (TC)), and Package/case (316-BBGA).

Selection Notes
  • For 25PPC405CR-3BB200C, double-check the mounting type (Surface Mount) for your intended installation method.
  • Verify the operating temperature range (-40°C ~ 85°C (TC)) and derate as needed in your application.
  • Make sure RAM Controllers (SDRAM) aligns with your design targets and verification plan.
Alternates & Substitutions
  • In Microprocessors designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Confirm the real operating corners (temperature -40°C ~ 85°C (TC)) and avoid swaps that only work at typical conditions.
  • Begin with the constraints that are hardest to change later: package/case 316-BBGA, supplier package 316-EPBGA (27x27), mounting Surface Mount.
  • For digital parts, align speed 200MHz and validate firmware/boot and signal integrity assumptions before production.
FAQ

Who is the manufacturer of 25PPC405CR-3BB200C?
IBM

Any tips for migrating firmware to 25PPC405CR-3BB200C?
Confirm pin functions, peripheral differences, timing assumptions, and memory layout, then validate under worst-case operating conditions.

What is the Number of Cores/Bus Width of 25PPC405CR-3BB200C?
1 Core, 32-Bit

Which Supplier Device Package is specified for 25PPC405CR-3BB200C?
316-EPBGA (27x27)

Application Scenarios

Selecting IBM 25PPC405CR-3BB200C for Microprocessors usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. In practice, they execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Within building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • Confirm boot mode, strapping, and reset sequencing so bring-up is deterministic across assembly variance during bring-up and production test.
  • For compatibility, plan debug and production test access early so firmware loading, boundary checks, and fault recovery are repeatable. This keeps integration from depending on typical-only conditions.
Project Fit
  • Less ideal when integrating IBM 25PPC405CR-3BB200C for Microprocessors, programming and debug access are not practical, increasing field recovery risk, because the behavior cannot be verified in a repeatable way.
25PPC405CR-3BB200C25PPC405CR-3BB200C
$40.48
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