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25PPC405GP-3BC200C

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— IC芯片 | 连接器 | 传感器 | 被动器件 —

25PPC405GP-3BC200C

25PPC405GP-3BC200C

$40.48
  • Description：IC MPU 200MHZ 456EPBGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk

SKU:740b328b922c Category: Brand:

　　
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Product Detailed Parameters

  • Description：IC MPU 200MHZ 456EPBGA
  • Series：*
  • Mfr：IBM
  • Package：Bulk
  • Core Processor：PowerPC 405
  • Number of Cores/Bus Width：1 Core, 32-Bit
  • Speed：200MHz
  • Co-Processors/DSP：-
  • RAM Controllers：SDRAM
  • Graphics Acceleration：No
  • Display & Interface Controllers：-
  • Ethernet：10/100Mbps (1)
  • SATA：-
  • USB：-
  • Voltage - I/O：3.3V
  • Operating Temperature：-40°C ~ 85°C (TC)
  • Security Features：-
  • Mounting Type：Surface Mount
  • Package / Case：456-BBGA
  • Supplier Device Package：456-EPBGA (35x35)
  • Additional Interfaces：DMA, GPIO, I2C, PCI, UART

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25PPC405GP-3BC200C

How to buy
Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.
Payment Method
Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.
Delivery time
In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.
Freight calculation
Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.
Mode of Transportation
We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.
Return and Refund
Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

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Buying Guide
Summary

IBM 25PPC405GP-3BC200C is selected in Microprocessors category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC MPU 200MHZ 456EPBGA), Core (PowerPC 405), Speed (200MHz), Temperature (-40°C ~ 85°C (TC)), and Package/case (456-BBGA).

Selection Notes
  • For 25PPC405GP-3BC200C, validate the operating temperature range (-40°C ~ 85°C (TC)) for your environment and margin.
  • Confirm Voltage - I/O (3.3V) is suitable for your use case and operating conditions.
  • Verify the package/case (456-BBGA) fits your mechanical constraints and assembly process.
Alternates & Substitutions
  • In Microprocessors, confirm that alternates preserve startup states and fault behavior so system behavior does not change quietly.
  • Compare not just numbers but also the conditions: rails, loads, timing, and temperature points behind the spec table.
  • Then confirm the operating envelope (temperature -40°C ~ 85°C (TC)) with margin for transients and derating.
  • For digital parts, align speed 200MHz and validate firmware/boot and signal integrity assumptions before production.
FAQ

What packaging is listed for 25PPC405GP-3BC200C?
Bulk

What Additional Interfaces does 25PPC405GP-3BC200C have?
DMA, GPIO, I2C, PCI, UART

What mounting type does 25PPC405GP-3BC200C use?
Surface Mount

What RAM Controllers does 25PPC405GP-3BC200C have?
SDRAM

Application Scenarios

Selecting IBM 25PPC405GP-3BC200C for Microprocessors usually comes down to meeting the system constraints that matter most: limits, interfaces, and testability in the real build. In real deployments, they execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. Across building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. Across smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • During bring-up and production test, validate that alternate parts preserve boot modes, memory interfaces, and critical timing assumptions rather than only pinout. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • Good fit when you can verify IBM 25PPC405GP-3BC200C for Microprocessors integration across temperature and supply corners, and you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • Poor fit when debug and programming access is not practical, increasing field recovery risk, because the integration depends on constraints that cannot be controlled across builds.
25PPC405GP-3BC200C25PPC405GP-3BC200C
$40.48
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