25PPC750CXEFP2013T

25PPC750CXEFP2013T

$22.27
  • Description:IC MPU 400MHZ 256BGA
  • Series:*
  • Mfr:IBM
  • Package:Bulk

SKU:658f78199b95 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC MPU 400MHZ 256BGA
  • Series:*
  • Mfr:IBM
  • Package:Bulk
  • Core Processor:PowerPC 750CX
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:400MHz
  • Co-Processors/DSP:-
  • RAM Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:1.8V, 2.5V
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-PBGA (27x27)
  • Additional Interfaces:-

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25PPC750CXEFP2013T

Buying Guide
Summary

IBM 25PPC750CXEFP2013T is used in Microprocessors category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MPU 400MHZ 256BGA), Core (PowerPC 750CX), Speed (400MHz), Temperature (0°C ~ 105°C (TJ)), and Package/case (256-LBGA).

Selection Notes
  • For 25PPC750CXEFP2013T, double-check the mounting type (Surface Mount) for your intended installation method.
  • Verify the operating temperature range (0°C ~ 105°C (TJ)) and derate as needed in your application.
  • Check Number of Cores/Bus Width (1 Core, 32-Bit) against the datasheet conditions and your system-level constraints.
  • Confirm the package/case (256-LBGA) matches your PCB footprint and land pattern.
Alternates & Substitutions
  • For Microprocessors, validate alternates under worst-case corners rather than assuming typical-only conditions represent production builds.
  • Treat package/case 256-LBGA, supplier package 256-PBGA (27x27), mounting Surface Mount as the first filter, then move on to electrical and performance checks.
  • For MCU/memory substitutions, match speed 400MHz and verify pin-mux, timing margins, and power sequencing.
  • To speed up alternate matching, provide your must-have constraints (package 256-LBGA) and any compliance/traceability needs.
FAQ

What details help you quote 25PPC750CXEFP2013T quickly?
Provide the part number (25PPC750CXEFP2013T), quantity, required lead time, and any packaging or documentation requirements.

Who is the manufacturer of 25PPC750CXEFP2013T?
IBM

Which packaging option is listed for 25PPC750CXEFP2013T?
Bulk

What Graphics Acceleration is listed for 25PPC750CXEFP2013T?
No

Application Scenarios

For many Microprocessors designs, IBM 25PPC750CXEFP2013T is vetted against electrical margins, thermal headroom, and mechanical integration before the BOM is frozen. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. A short worst-case validation run can quickly separate robust designs from fragile ones. Early targeted testing tends to expose true integration risks before a design is scaled to production. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. Across consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. This is how teams keep performance stable without relying on fragile tuning steps.

Compatibility Advice
  • In qualification work, verify clock, debug, and programming access so production test and field recovery are practical. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • A practical check is to define acceptance criteria and validate the key assumptions across temperature and supply corners before approving substitutions.
25PPC750CXEFP2013T25PPC750CXEFP2013T
$22.27
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