2DIB0411FXUMA1

2DIB0411FXUMA1

$1.15
  • Description:DGTL ISOLTR 3KV 2CH GP 8-SOIC
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:25768359f298 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:DGTL ISOLTR 3KV 2CH GP 8-SOIC
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Number of Channels:2
  • Voltage - Isolation:3000Vrms
  • Rise / Fall Time (Typ):4ns, 4ns (Max)
  • Operating Temperature:-40°C ~ 150°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:PG-DSO-8-82
  • Grade:-
  • Qualification:-

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2DIB0411FXUMA1

Buying Guide
Summary

Infineon Technologies 2DIB0411FXUMA1 is an electronic component in Digital Isolators category. Key specs: description: DGTL ISOLTR 3KV 2CH GP 8-SOIC; packaging: Tape & Reel (TR),Cut Tape (CT); temperature: -40°C ~ 150°C; package/case: 8-SOIC (0.154", 3.90mm Width); mounting: Surface Mount.

Selection Notes
  • For 2DIB0411FXUMA1, confirm package/case 8-SOIC (0.154", 3.90mm Width), mounting Surface Mount to ensure footprint compatibility.
  • For 2DIB0411FXUMA1, validate the operating temperature range (-40°C ~ 150°C) against your environment.
  • For 2DIB0411FXUMA1, review the latest datasheet revision and confirm key electrical characteristics for your use case (packaging Tape & Reel (TR),Cut Tape (CT); temperature -40°C ~ 150°C).
FAQ

What information do you need to quote 2DIB0411FXUMA1?
Send the part number (2DIB0411FXUMA1), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 2DIB0411FXUMA1?
Infineon Technologies

What is the package/case of 2DIB0411FXUMA1?
8-SOIC (0.154", 3.90mm Width)

What is the mounting type of 2DIB0411FXUMA1?
Surface Mount

Application Scenarios
In the Digital Isolators category, Infineon Technologies 2DIB0411FXUMA1 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. Isolation strategy is treated as a system-level choice that interacts with grounding, creepage/clearance, EMC, and safety compliance. A well-designed isolation boundary improves robustness and reduces field failures caused by transients and ground shifts. In industrial automation, isolation protects MCU and I/O domains from ground shifts and transients on long field wiring, improving uptime in noisy cabinets. In motor drives and power supplies, isolated feedback and control paths tolerate high dv/dt switching and help meet safety and EMC requirements. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
2DIB0411FXUMA12DIB0411FXUMA1
$1.15
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