4DB0226KA3AVG

4DB0226KA3AVG

  • Description:IC DDR4 DATA BUFFER 53FCCCSP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:9fc2bbde9e4d Category: Brand:

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Product Detailed Parameters

  • Description:IC DDR4 DATA BUFFER 53FCCCSP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Controller Type:Dynamic RAM (DRAM)
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:53-TFBGA, FCCSP
  • Supplier Device Package:53-FCCSP (7.5x3)

Download product information

4DB0226KA3AVG

Buying Guide
Summary

Renesas Electronics Corporation 4DB0226KA3AVG is an electronic component in Controllers category. Key specs: description: IC DDR4 DATA BUFFER 53FCCCSP; packaging: Tray; package/case: 53-TFBGA, FCCSP; mounting: Surface Mount.

Selection Notes
  • For 4DB0226KA3AVG, confirm package/case 53-TFBGA, FCCSP, mounting Surface Mount to ensure footprint compatibility.
  • For 4DB0226KA3AVG, for replacements, match pinout/footprint first, then verify min/max ratings and timing margins (package/case 53-TFBGA, FCCSP; mounting Surface Mount).
  • For 4DB0226KA3AVG, confirm packaging option and moisture sensitivity handling if your assembly process requires it (packaging Tray; package/case 53-TFBGA, FCCSP).
FAQ

What should I provide for an accurate quote for 4DB0226KA3AVG?
Send the part number (4DB0226KA3AVG), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 4DB0226KA3AVG?
Renesas Electronics Corporation

What is the mounting type of 4DB0226KA3AVG?
Surface Mount

What is the packaging of 4DB0226KA3AVG?
Tray

Application Scenarios
Renesas Electronics Corporation 4DB0226KA3AVG is listed under the Controllers category and is commonly used when correctness, reliability, and qualification repeatability matter. Engineers validate electrical limits, mechanical fit, and environmental behavior so qualification is repeatable. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. In lab and test systems, predictable parts improve repeatability for calibration and validation workflows. Overall, disciplined selection and verification reduce integration risk and improve field reliability.
4DB0226KA3AVG4DB0226KA3AVG

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