4DB0226KA3AVG8

4DB0226KA3AVG8

  • Description:IC DDR4 DATA BUFFER 53FCCCSP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)

SKU:ab5f206db5d2 Category: Brand:

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Product Detailed Parameters

  • Description:IC DDR4 DATA BUFFER 53FCCCSP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)
  • Controller Type:Dynamic RAM (DRAM)
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:53-TFBGA, FCCSP
  • Supplier Device Package:53-FCCSP (7.5x3)

Download product information

4DB0226KA3AVG8

Buying Guide
Summary

Renesas Electronics Corporation 4DB0226KA3AVG8 is an electronic component in Controllers category. Key specs: description: IC DDR4 DATA BUFFER 53FCCCSP; packaging: Tape & Reel (TR); package/case: 53-TFBGA, FCCSP; mounting: Surface Mount.

Selection Notes
  • For 4DB0226KA3AVG8, confirm package/case 53-TFBGA, FCCSP, mounting Surface Mount to ensure footprint compatibility.
  • For 4DB0226KA3AVG8, if you plan to run near limits, apply derating and validate on your worst-case operating conditions (mounting Surface Mount; packaging Tape & Reel (TR)).
  • For 4DB0226KA3AVG8, if this is for production, consider sourcing and lifecycle risk (second source / availability) (package/case 53-TFBGA, FCCSP; mounting Surface Mount).
FAQ

How can I request a quote for 4DB0226KA3AVG8?
Send the part number (4DB0226KA3AVG8), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 4DB0226KA3AVG8?
Renesas Electronics Corporation

What is the packaging of 4DB0226KA3AVG8?
Tape & Reel (TR)

What is the package/case of 4DB0226KA3AVG8?
53-TFBGA, FCCSP

Application Scenarios
Renesas Electronics Corporation 4DB0226KA3AVG8 in the Controllers category is typically selected when engineers need predictable, spec-driven behavior in a production design. A good selection improves integration speed and lowers lifecycle risk. They provide a focused function that reduces system integration risk and helps meet requirements in real deployments. In networking hardware, specialized parts reduce re-spin risk by providing proven behavior in dense racks. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it supports long-term maintainability by using clear selection criteria and repeatable validation practices.
4DB0226KA3AVG84DB0226KA3AVG8

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