5082-7623

5082-7623

  • Description:DISPLAY 7-SEG 0.3" SGL YLW 14DIP
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tube

SKU:4987b8d97767 Category: Brand:

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Product Detailed Parameters

  • Description:DISPLAY 7-SEG 0.3" SGL YLW 14DIP
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tube
  • Number of Characters:1
  • Size / Dimension:0.750" H x 0.400" W x 0.180" D (19.05mm x 10.16mm x 4.57mm)
  • Digit/Alpha Size:0.30" (7.62mm)
  • Display Type:7-Segment
  • Common Pin:Common Cathode
  • Color:Yellow
  • Voltage - Forward (Vf) (Typ):2.2V
  • Current - Test:20mA
  • Millicandela Rating:0.62mcd
  • Wavelength - Peak:583nm
  • Power Dissipation (Max):80mW
  • Package / Case:14-DIP (0.300", 7.62mm), 10 Leads
  • Display Format:-

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5082-7623

Buying Guide
Summary

Broadcom Limited 5082-7623 is an electronic component in LED Character and Numeric category. Key specs: description: DISPLAY 7-SEG 0.3" SGL YLW 14DIP; packaging: Tube; package/case: 14-DIP (0.300", 7.62mm), 10 Leads.

Selection Notes
  • For 5082-7623, confirm package/case 14-DIP (0.300", 7.62mm), 10 Leads to ensure footprint compatibility.
  • For 5082-7623, if this is for production, consider sourcing and lifecycle risk (second source / availability) (package/case 14-DIP (0.300", 7.62mm), 10 Leads; packaging Tube).
  • For 5082-7623, review the latest datasheet revision and confirm key electrical characteristics for your use case (package/case 14-DIP (0.300", 7.62mm), 10 Leads; packaging Tube).
FAQ

How can I request a quote for 5082-7623?
Send the part number (5082-7623), quantity, target delivery date, and any required packaging or documentation.

Who is the manufacturer/brand for 5082-7623?
Broadcom Limited

What is the packaging of 5082-7623?
Tube

What is the package/case of 5082-7623?
14-DIP (0.300", 7.62mm), 10 Leads

Application Scenarios
In the LED Character and Numeric category, Broadcom Limited 5082-7623 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. They are chosen when a targeted building block is more reliable and maintainable than a custom discrete implementation. A good selection improves integration speed and lowers lifecycle risk. In automotive subsystems, robust components help meet reliability targets under thermal cycling and electrical transients. In embedded systems with strict size and power budgets, integration reduces BOM and validation effort while keeping behavior predictable. Overall, it strengthens system robustness by aligning electrical, thermal, and mechanical constraints with real deployment conditions.
5082-76235082-7623

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