5962-8753103XA

5962-8753103XA

  • Description:IC FIFO ASYNC 512X9 80NS 28CDIP
  • Series:7200
  • Mfr:Renesas Electronics Corporation
  • Package:Tube

SKU:1bd3e5966fbd Category: Brand:

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Product Detailed Parameters

  • Description:IC FIFO ASYNC 512X9 80NS 28CDIP
  • Series:7200
  • Mfr:Renesas Electronics Corporation
  • Package:Tube
  • Memory Size:4.5K (512 x 9)
  • Function:Asynchronous
  • Data Rate:10MHz
  • Access Time:80ns
  • Voltage - Supply:4.5 V ~ 5.5 V
  • Current - Supply (Max):100mA
  • Bus Directional:Uni-Directional
  • Expansion Type:Depth, Width
  • Programmable Flags Support:No
  • Retransmit Capability:Yes
  • FWFT Support:No
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Through Hole
  • Package / Case:28-CDIP (0.600", 15.24mm)
  • Supplier Device Package:28-CDIP

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5962-8753103XA

Buying Guide
Summary

Renesas Electronics Corporation 5962-8753103XA is selected in FIFOs Memory category when storage behavior must remain predictable across temperature and production variance. Key specs include Description (IC FIFO ASYNC 512X9 80NS 28CDIP), Temperature (-55°C ~ 125°C), Package/case (28-CDIP (0.600", 15.24mm)), Mounting (Through Hole), and Packaging (Tube).

Selection Notes
  • For 5962-8753103XA, confirm the supply voltage requirement (4.5 V ~ 5.5 V) and any rail tolerance constraints.
  • Verify the storage capacity (4.5K (512 x 9)) provides enough headroom for future expansion.
  • Validate the operating temperature range (-55°C ~ 125°C) for your environment and margin.
Alternates & Substitutions
  • Keep the assembly and footprint constraints consistent (package/case 28-CDIP (0.600", 15.24mm), supplier package 28-CDIP, mounting Through Hole) to avoid a late PCB change.
  • For digital parts, align memory 4.5K (512 x 9) and validate firmware/boot and signal integrity assumptions before production.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
  • If you already have candidate alternates, send the list and we can check drop-in risks against (package 28-CDIP (0.600", 15.24mm), supply 4.5 V ~ 5.5 V, frequency 10MHz).
FAQ

Who is the manufacturer of 5962-8753103XA?
Renesas Electronics Corporation

Any tips for reliable operation with 5962-8753103XA?
Ensure robust power sequencing, adequate decoupling capacitors, and verify signal integrity on high-speed data buses.

Which Expansion Type is specified for 5962-8753103XA?
Depth, Width

Which Bus Directional is listed for 5962-8753103XA?
Uni-Directional

Application Scenarios

When sourcing Renesas Electronics Corporation 5962-8753103XA for FIFOs Memory, engineers typically focus on de-risking integration and keeping validation repeatable. Engineers typically balance latency, endurance, retention, interface speed, and data integrity features such as ECC or wear management. They are often essential for stable boot flows, logging, configuration retention, and smoothing bursty traffic in pipelines. In IoT gateways, reliable storage supports OTA rollback and stable boot flows during brownouts. Across portable instruments, non-volatile storage preserves configuration and audit trails with controlled write policies to avoid premature wear. Across embedded gateways, reliable storage supports OTA update rollback and stable boot flows during brownouts. After the datasheet-level fit is confirmed, most remaining risk is board-level integration on the actual PCB and enclosure. Over the product lifecycle, it reduces maintenance burden by keeping behavior spec-driven and testable.

Compatibility Advice
  • In practice, plan measurable bring-up tests so acceptance criteria are objective and repeatable across lots during bring-up and production test.
  • In practice, confirm EMC/EMI constraints are addressed in layout and wiring so compliance does not require late redesign before release to production.
  • To keep validation repeatable, verify second-source equivalence by re-checking ratings, timing, and thermal limits rather than assuming drop-in compatibility. This reduces the chance that substitutions push hidden limits.
Project Fit
  • Good fit when you can test and document Renesas Electronics Corporation 5962-8753103XA for FIFOs Memory integration across temperature and supply corners, and you want measurable acceptance criteria for production test.
  • Poor fit when the goal is only quick proof-of-concept without validation coverage, because the key behaviors cannot be confirmed on the assembled system.
5962-8753103XA5962-8753103XA

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