66AK2H06AAAW2

66AK2H06AAAW2

$181.66
  • Description:IC DSP ARM SOC 1517BGA
  • Series:66AK2Hx KeyStone Multicore

SKU:42c68fa9222e Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517BGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06AAAW2

Buying Guide
Summary

Texas Instruments 66AK2H06AAAW2 is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC DSP ARM SOC 1517BGA), Temperature (0°C ~ 85°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H06AAAW2, verify the data interface (EBI/EMI, Ethernet, DMA, etc.) and timing requirements for your system.
  • Confirm the operating temperature range (0°C ~ 85°C (TC)) meets your deployment conditions.
  • Check On-Chip RAM (8.375MB) against the datasheet conditions and your system-level constraints.
  • Make sure the mounting type (Surface Mount) matches how the part will be installed and inspected.
Alternates & Substitutions
  • In DSP (Digital Signal Processors) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Begin with the constraints that are hardest to change later: package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount.
  • Confirm the real operating corners (temperature 0°C ~ 85°C (TC)) and avoid swaps that only work at typical conditions.
  • For digital parts, align interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and validate firmware/boot and signal integrity assumptions before production.
FAQ

What Voltage - Core is listed for 66AK2H06AAAW2?
Variable

How is 66AK2H06AAAW2 supplied (packaging)?
Tray

What Supplier Device Package does 66AK2H06AAAW2 have?
1517-FCBGA (40x40)

What operating temperature range does 66AK2H06AAAW2 support?
0°C ~ 85°C (TC)

Application Scenarios

For Texas Instruments 66AK2H06AAAW2 in the DSP (Digital Signal Processors) category, teams usually prioritize documentation clarity and repeatable behavior in production. They execute firmware or algorithms and coordinate peripherals, communications, and security features that define product capabilities. In real deployments, selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • To reduce integration risk, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds on the assembled PCB.
Project Fit
  • Good fit when you can verify Texas Instruments 66AK2H06AAAW2 for DSP (Digital Signal Processors) integration on the assembled PCB, and you have defined I/O domain constraints and can validate mixed-voltage interfaces on assembled hardware.
  • Poor fit when debug and programming access is not practical, increasing field recovery risk, because it becomes difficult to prove margin across production variance.
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