66AK2H06BAAWA24

66AK2H06BAAWA24

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:05d0234e999d Category: Brand:

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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz DSP, 1.4GHz ARM®
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06BAAWA24

Buying Guide
Summary

Texas Instruments 66AK2H06BAAWA24 is selected in DSP (Digital Signal Processors) category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC DSP ARM SOC 1517FCBGA), Temperature (-40°C ~ 100°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H06BAAWA24, verify the operating temperature range (-40°C ~ 100°C (TC)) and derate as needed in your application.
  • Verify Voltage - Core (Variable) matches your requirements and the datasheet test conditions.
  • Double-check the mounting type (Surface Mount) for your intended installation method.
  • Double-check the data interface (EBI/EMI, Ethernet, DMA, etc.) for integration and verification planning.
Alternates & Substitutions
  • In DSP (Digital Signal Processors) designs, define acceptance criteria up front so alternates can be qualified and repeated in production.
  • Start with mechanical equivalence and keep package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount aligned so the alternate is footprint-safe.
  • For digital parts, align interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and validate firmware/boot and signal integrity assumptions before production.
  • Always compare the datasheet test conditions behind key specs (load, frequency, temperature) to avoid swapping in a part that was characterized differently.
FAQ

What details help you quote 66AK2H06BAAWA24 quickly?
Share the part number (66AK2H06BAAWA24), quantity, target delivery date, and any packaging or documentation requirements.

What package/case is listed for 66AK2H06BAAWA24?
1517-BBGA, FCBGA

Can you confirm the Interface for 66AK2H06BAAWA24?
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0

What mounting type does 66AK2H06BAAWA24 use?
Surface Mount

Application Scenarios

In many DSP (Digital Signal Processors) builds, Texas Instruments 66AK2H06BAAWA24 is reviewed for predictable behavior, supportability, and stable qualification evidence. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. In real deployments, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In practice, within medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. In real deployments, that context is why these parts show up in the following real-world scenarios. In practice, this is often what separates a prototype that works from a product that stays reliable in the field.

Compatibility Advice
  • In qualification work, validate that alternate parts preserve boot modes, memory interfaces, and critical timing assumptions rather than only pinout. This helps field behavior stay predictable across lots.
  • In practice, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds and temperature and supply corners.
Project Fit
  • Best fit for DSP (Digital Signal Processors) when you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
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