66AK2H06DAAWA2

66AK2H06DAAWA2

$535.02
  • Description:66AK2H06DAAWA2
  • Series:66AK2Hx KeyStone Multicore

SKU:4de116c646be Category: Brand:

  
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Product Detailed Parameters

  • Description:66AK2H06DAAWA2
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:8.375MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H06DAAWA2

Buying Guide
Summary

Texas Instruments 66AK2H06DAAWA2 is used in DSP (Digital Signal Processors) category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (66AK2H06DAAWA2), Temperature (-40°C ~ 100°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H06DAAWA2, verify the package/case (1517-BBGA, FCBGA) fits your mechanical constraints and assembly process.
  • Confirm the data interface (EBI/EMI, Ethernet, DMA, etc.) matches your host interface and timing requirements.
  • Validate the operating temperature range (-40°C ~ 100°C (TC)) for your environment and margin.
Alternates & Substitutions
  • For DSP (Digital Signal Processors) substitutions, lock footprint/pinout and operating envelope first, then verify the critical performance conditions on your hardware.
  • Confirm the physical match (package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount) and the operating corners (temperature -40°C ~ 100°C (TC)) so the substitution is not a hidden redesign.
  • For MCU/memory substitutions, match interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and verify pin-mux, timing margins, and power sequencing.
  • For faster alternate proposals, share the constraints you cannot change (package 1517-BBGA, FCBGA, interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0) and your acceptable trade-offs.
FAQ

Which Voltage - I/O is specified for 66AK2H06DAAWA2?
0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V

What Voltage - Core is listed for 66AK2H06DAAWA2?
Variable

Which operating temperature range is listed for 66AK2H06DAAWA2?
-40°C ~ 100°C (TC)

Which Interface is listed for 66AK2H06DAAWA2?
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0

Application Scenarios

When sourcing Texas Instruments 66AK2H06DAAWA2 for DSP (Digital Signal Processors), engineers typically focus on de-risking integration and keeping validation repeatable. Selection is driven by compute headroom, peripheral mix, toolchain maturity, lifecycle availability, and secure boot/update strategy. They commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In IoT devices, secure boot and low-power modes enable years-long deployments in outdoor enclosures exposed to humidity and temperature swings. In medical devices, deterministic processing and audit logging support regulated workflows and long-term maintainability. A handful of targeted tests often shows whether the design is robust or just passes under typical conditions. For systems shipped at volume, predictable behavior is what keeps yield and field performance stable.

Compatibility Advice
  • For DSP (Digital Signal Processors) compatibility, validate boot/reset sequencing, power integrity, and timing margins on the assembled system. This keeps acceptance criteria measurable and repeatable.
Project Fit
  • A weaker fit when integrating Texas Instruments 66AK2H06DAAWA2 for DSP (Digital Signal Processors), I/O voltage domains are uncertain, increasing long-term overstress and compatibility risk, because the integration depends on constraints that cannot be controlled across builds.
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