66AK2H12AAAWA2

66AK2H12AAAWA2

$374.16
  • Description:IC DSP ARM SOC 1517BGA
  • Series:66AK2Hx KeyStone Multicore

SKU:021b6928c788 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517BGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H12AAAWA2

Buying Guide
Summary

Texas Instruments 66AK2H12AAAWA2 is selected in DSP (Digital Signal Processors) category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC DSP ARM SOC 1517BGA), Temperature (-40°C ~ 100°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H12AAAWA2, confirm the data interface (EBI/EMI, Ethernet, DMA, etc.) matches your host interface and timing requirements.
  • Validate the operating temperature range (-40°C ~ 100°C (TC)) for your environment and margin.
  • Verify On-Chip RAM (12.75MB) and compare it against your reference design limits.
Alternates & Substitutions
  • For DSP (Digital Signal Processors), compare the datasheet test conditions behind key specs and re-check the margins that were tightest during bring-up.
  • Treat package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount as the first filter, then move on to electrical and performance checks.
  • For MCU/memory substitutions, match interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and verify pin-mux, timing margins, and power sequencing.
  • To speed up alternate matching, provide your must-have constraints (package 1517-BBGA, FCBGA, interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0) and any compliance/traceability needs.
FAQ

Which Voltage - I/O is listed for 66AK2H12AAAWA2?
0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V

Which package/case is specified for 66AK2H12AAAWA2?
1517-BBGA, FCBGA

What operating temperature range does 66AK2H12AAAWA2 support?
-40°C ~ 100°C (TC)

Can you confirm the Interface for 66AK2H12AAAWA2?
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0

Application Scenarios

In practice, the question for Texas Instruments 66AK2H12AAAWA2 in DSP (Digital Signal Processors) is whether it stays inside the electrical/thermal envelope while remaining easy to validate and support. They often sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In industrial automation, controllers run deterministic logic and protocol stacks in EMI-heavy cabinets with dust and vibration. Within smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime. Within automotive and transportation, they manage gateways and subsystem controllers that must survive thermal cycling and support safety diagnostics. This approach keeps behavior predictable across manufacturing variance and operating conditions.

Compatibility Advice
  • Validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided with the final enclosure and cabling.
  • Across temperature and supply corners, confirm boot strapping, reset sequencing, and programming access so bring-up and recovery are deterministic across builds. This avoids one-off tuning in production.
Project Fit
  • More fragile when integrating Texas Instruments 66AK2H12AAAWA2 for DSP (Digital Signal Processors), debug and programming access is not practical, increasing field recovery risk, because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
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