66AK2H12BAAW2

66AK2H12BAAW2

$448.16
  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore

SKU:b8717477ec61 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:IC DSP ARM SOC 1517FCBGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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66AK2H12BAAW2

Buying Guide
Summary

Texas Instruments 66AK2H12BAAW2 is selected in DSP (Digital Signal Processors) category when firmware headroom and I/O planning must remain stable across revisions. Key specs include Description (IC DSP ARM SOC 1517FCBGA), Temperature (0°C ~ 85°C (TC)), Package/case (1517-BBGA, FCBGA), and Mounting (Surface Mount).

Selection Notes
  • For 66AK2H12BAAW2, confirm the data interface (EBI/EMI, Ethernet, DMA, etc.) matches your host interface and timing requirements.
  • Validate the operating temperature range (0°C ~ 85°C (TC)) for your environment and margin.
  • Confirm Voltage - I/O (0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V) and ensure it matches your integration requirements.
  • Ensure the package/case (1517-BBGA, FCBGA) and land pattern match your PCB layout before procurement.
Alternates & Substitutions
  • For DSP (Digital Signal Processors), treat alternates as an integration task and validate the assumptions that matter on the assembled system.
  • Make sure the alternate stays inside your system envelope: temperature 0°C ~ 85°C (TC).
  • Keep the assembly and footprint constraints consistent (package/case 1517-BBGA, FCBGA, supplier package 1517-FCBGA (40x40), mounting Surface Mount) to avoid a late PCB change.
  • For digital parts, align interface EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 and validate firmware/boot and signal integrity assumptions before production.
FAQ

How is 66AK2H12BAAW2 packaged?
Tray

What Voltage - Core is listed for 66AK2H12BAAW2?
Variable

Which operating temperature range is listed for 66AK2H12BAAW2?
0°C ~ 85°C (TC)

Which Non-Volatile Memory is listed for 66AK2H12BAAW2?
ROM (384kB)

Application Scenarios

For Texas Instruments 66AK2H12BAAW2 in the DSP (Digital Signal Processors) category, teams usually prioritize documentation clarity and repeatable behavior in production. In real deployments, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. Well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. Within building automation, local compute keeps systems functional even when cloud connectivity is intermittent. In consumer products, compute and peripheral integration reduces BOM and speeds product iterations while maintaining stable user experience. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.

Compatibility Advice
  • In practice, check that alternates preserve boot ROM behavior and critical peripherals, not only pin count and frequency. This reduces the chance that substitutions push hidden limits.
Project Fit
  • Strongest fit when you can validate Texas Instruments 66AK2H12BAAW2 for DSP (Digital Signal Processors) integration with the real wiring and cabling, especially if you need deterministic boot and recovery behavior and can validate it across power cycling and resets.
  • A practical check is to define acceptance criteria and validate the key assumptions with the real wiring and cabling before approving substitutions.
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